XC3S200AN-4FT256C
- Mfr.Part #
- XC3S200AN-4FT256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 195 I/O 256FTBGA
- Stock
- 7,453
- In Stock :
- 7,453
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Speed Grade :
- 4
- Number of CLBs :
- 448
- Published :
- 1999
- ECCN Code :
- EAR99
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Package / Case :
- 256-LBGA
- Factory Lead Time :
- 10 Weeks
- Number of Outputs :
- 160
- Series :
- Spartan®-3AN
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 4032
- Length :
- 17mm
- Number of I/O :
- 195
- Radiation Hardening :
- No
- Number of LABs/CLBs :
- 448
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Terminations :
- 256
- Pbfree Code :
- No
- RAM Size :
- 36KB
- JESD-609 Code :
- e0
- Width :
- 17mm
- Clock Frequency :
- 667MHz
- Pin Count :
- 256
- Number of Pins :
- 256
- Terminal Pitch :
- 1mm
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 240
- Mount :
- Surface Mount
- Power Supplies :
- 1.21.2/3.33.3V
- Height Seated (Max) :
- 1.55mm
- Total RAM Bits :
- 294912
- Operating Supply Voltage :
- 1.2V
- Voltage - Supply :
- 1.14V~1.26V
- Number of Gates :
- 200000
- Operating Temperature :
- 0°C~85°C TJ
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- RoHS Status :
- Non-RoHS Compliant
- Terminal Form :
- Ball
- Base Part Number :
- XC3S200AN
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- XC3S200AN-4FT256C

FPGAs AMD Xilinx XC3S200AN-4FT256C Overview
The FPGAs AMD Xilinx XC3S200AN-4FT256C is a highly capable FPGA (Field Programmable Gate Array) designed to meet the demanding needs of modern digital applications. Manufactured by the renowned AMD Xilinx, this FPGA is engineered to deliver exceptional performance and flexibility with its advanced features. It supports a variety of digital and mixed-signal applications, making it an ideal choice for designers seeking a robust platform for their complex designs. The IC FPGA 195 I/O 256FTBGA package ensures ample I/O options and compact integration into various systems, highlighting its suitability for scalable and high-performance integrated solutions.
XC3S200AN-4FT256C Features
This product boasts a comprehensive set of features that enhance its utility and efficiency in complex digital environments. It includes 195 I/O pins that provide extensive interfacing capabilities. The 256FTBGA packaging is not only space-efficient but also offers robust performance in a compact form factor. This makes the XC3S200AN-4FT256C particularly valuable for applications where space and weight are critical constraints.
XC3S200AN-4FT256C Applications
- Communications Equipment: Utilized in routers, switches, and other network devices for its ability to handle complex signal processing tasks efficiently.
- Consumer Electronics: Embedded in devices such as high-definition televisions and gaming consoles to enhance multimedia processing capabilities.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS) and infotainment systems to process real-time data for improved safety and user experience.
- Industrial Automation: Used in control systems for real-time operational efficiency and reliability in manufacturing processes.
- Medical Devices: Integral in the design of medical imaging equipment, ensuring precise and quick processing of complex datasets for better diagnostic capabilities.
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