XC3S200A-4FT256I
- Mfr.Part #
- XC3S200A-4FT256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 195 I/O 256FTBGA
- Stock
- 6,029
- In Stock :
- 6,029
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mount :
- Surface Mount
- Base Part Number :
- XC3S200A
- Published :
- 2007
- Qualification Status :
- Not Qualified
- Speed Grade :
- 4
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Outputs :
- 160
- Terminal Pitch :
- 1mm
- Pbfree Code :
- No
- Series :
- Spartan®-3A
- RoHS Status :
- Non-RoHS Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 448
- JESD-609 Code :
- e0
- Number of Logic Elements/Cells :
- 4032
- Length :
- 17mm
- Width :
- 17mm
- Reach Compliance Code :
- not_compliant
- Supply Voltage :
- 1.2V
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- ECCN Code :
- EAR99
- Peak Reflow Temperature (Cel) :
- 240
- Clock Frequency :
- 667MHz
- Number of Pins :
- 256
- Number of I/O :
- 195
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 1.2V
- Total RAM Bits :
- 294912
- Packaging :
- Tray
- Factory Lead Time :
- 10 Weeks
- Package / Case :
- 256-LBGA
- Number of Terminations :
- 256
- Voltage - Supply :
- 1.14V~1.26V
- Pin Count :
- 256
- Number of Gates :
- 200000
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Power Supplies :
- 1.22.5/3.3V
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of CLBs :
- 448
- RAM Size :
- 36KB
- Height Seated (Max) :
- 1.55mm
- Datasheets
- XC3S200A-4FT256I

FPGAs AMD Xilinx XC3S200A-4FT256I Overview
The AMD Xilinx XC3S200A-4FT256I FPGA is a highly capable integrated circuit designed for robust performance and versatility in a variety of demanding applications. This device is housed in a 256FTBGA package and boasts 195 I/O pins, providing substantial flexibility for interfacing with other key components. With its advanced capabilities, the XC3S200A-4FT256I is ideal for designers seeking a reliable and scalable solution to accommodate complex digital circuits while minimizing power consumption and maximizing speed. This FPGA is particularly suited for industries requiring high-speed data processing and intricate algorithm implementations, making it a cornerstone in the development of innovative technology solutions.
XC3S200A-4FT256I Features
The XC3S200A-4FT256I from AMD Xilinx stands out with several key features that make it a top choice for system designers. These features include a large number of user I/O pins, a robust package that supports complex circuit designs, and compatibility with multiple synthesis tools. This FPGA also supports advanced digital signal processing, high-speed data transfers, and flexible logic optimization capabilities, providing a versatile platform for creating highly customized configurations tailored to specific project needs.
XC3S200A-4FT256I Applications
- Telecommunications: Utilized in signal processing equipment, the XC3S200A-4FT256I helps manage data flows efficiently in high-speed networks, enhancing the performance and reliability of communication systems.
- Consumer Electronics: Serves as a critical component in the development of consumer electronics, such as gaming consoles and high-definition televisions, where it processes complex graphics and user inputs seamlessly.
- Automotive: Applied in automotive systems for sensor data processing and driver assistance features, this FPGA contributes to safer and more intelligent vehicle operations.
- Industrial: In industrial applications, the XC3S200A-4FT256I is integral in controlling machinery and processes, ensuring accurate and efficient automation and monitoring.
- Medical Devices: Supports the functionality of medical devices, such as imaging systems and diagnostic instruments, by facilitating rapid and precise data analysis and control.
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