XC3S200A-4FG320I
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- Mfr.Part #
- XC3S200A-4FG320I
- Manufacturer
- AMD Xilinx
- Package / Case
- 320-BGA
- Datasheet
- Download
- Description
- IC FPGA 248 I/O 320FBGA
- Stock
- 31,545
- In Stock ：
- 31,545
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 4032
- Number of I/O :
- 248
- Operating Temperature :
- -40°C~100°C TJ
- Base Part Number :
- XC3S200A
- Number of Gates :
- 200000
- Package / Case :
- 320-BGA
- Width :
- 19mm
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Terminal Position :
- BOTTOM
- RAM Size :
- 36KB
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- ECCN Code :
- 3A991.D
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- Non-RoHS Compliant
- Operating Supply Voltage :
- 1.2V
- Clock Frequency :
- 667MHz
- Number of Pins :
- 320
- Published :
- 1999
- Mount :
- Surface Mount
- Pbfree Code :
- No
- Length :
- 19mm
- Qualification Status :
- Not Qualified
- Number of Terminations :
- 320
- Supply Voltage :
- 1.2V
- Height Seated (Max) :
- 2mm
- Voltage - Supply :
- 1.14V~1.26V
- Pin Count :
- 320
- Factory Lead Time :
- 10 Weeks
- Series :
- Spartan®-3A
- Mounting Type :
- Surface Mount
- Reach Compliance Code :
- not_compliant
- Number of LABs/CLBs :
- 448
- Terminal Pitch :
- 1mm
- Terminal Form :
- Ball
- Number of CLBs :
- 448
- Peak Reflow Temperature (Cel) :
- 225
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e0
- Speed Grade :
- 4
- Number of Outputs :
- 192
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Packaging :
- Tray
- Total RAM Bits :
- 294912
- Power Supplies :
- 1.22.5/3.3V
- Datasheets
- XC3S200A-4FG320I
FPGAs AMD Xilinx XC3S200A-4FG320I Overview
The AMD Xilinx XC3S200A-4FG320I is a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding requirements of modern digital circuits. With a flexible 320FBGA package and a substantial array of 248 I/Os, this FPGA is ideal for developers looking to implement complex logic circuits while maintaining a small form factor. The device provides robust features for scalable architectures, making it a preferred choice for a wide range of industrial applications. The FPGA's ability to be reprogrammed on the fly adds immense value in rapidly changing tech environments, where long-term adaptability is as crucial as initial performance.
XC3S200A-4FG320I Features
This FPGA from AMD Xilinx offers a suite of features that enhances its utility in complex electronics. Its 320-pin fine-pitch ball grid array (FBGA) allows for a compact board size while supporting extensive functionality through its 248 I/O pins. The XC3S200A-4FG320I is optimized for high-speed digital processing, which is essential for both data-intensive and real-time applications. Moreover, the integration of advanced security protocols ensures reliable operation in critical applications, safeguarding data and system integrity against a range of threats.
XC3S200A-4FG320I Applications
- Communications Equipment: Utilized in routers, switches, and base stations to manage data flow efficiently and reliably.
- Consumer Electronics: Powers a variety of devices from high-definition televisions to gaming consoles, providing support for intricate digital logic required by modern consumer products.
- Automotive Systems: Implemented in driver assistance systems and infotainment units, enhancing both safety and user experience in modern vehicles.
- Industrial Automation: Critical in the operation of robotic arms and control systems, offering the precision and reliability required in automated manufacturing processes.
- Aerospace and Defense: Used in navigation systems and flight control units where high reliability and the ability to function in harsh environments are paramount.
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