XC3S2000-5FGG676C
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- Mfr.Part #
- XC3S2000-5FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 489 I/O 676FBGA
- Stock
- 14,686
- In Stock ：
- 14,686
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Length :
- 27mm
- Operating Temperature :
- 0°C~85°C TJ
- Package / Case :
- 676-BGA
- Mounting Type :
- Surface Mount
- Series :
- Spartan®-3
- Supply Voltage :
- 1.2V
- Number of Pins :
- 676
- Factory Lead Time :
- 10 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Published :
- 2008
- Number of Terminations :
- 676
- Total RAM Bits :
- 737280
- Voltage - Supply :
- 1.14V~1.26V
- RoHS Status :
- ROHS3 Compliant
- Number of Gates :
- 2000000
- Number of Logic Elements/Cells :
- 46080
- Mount :
- Surface Mount
- Speed Grade :
- 5
- JESD-609 Code :
- e1
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 676
- Operating Supply Voltage :
- 1.2V
- Number of LABs/CLBs :
- 5120
- ECCN Code :
- 3A991.D
- Height Seated (Max) :
- 2.6mm
- Number of I/O :
- 489
- Base Part Number :
- XC3S2000
- Terminal Form :
- Ball
- RAM Size :
- 90kB
- Width :
- 27mm
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 250
- Terminal Pitch :
- 1mm
- REACH SVHC :
- Unknown
- Qualification Status :
- Not Qualified
- Frequency :
- 725MHz
- Pbfree Code :
- yes
- Termination :
- SMD/SMT
- Number of Outputs :
- 489
- Terminal Position :
- BOTTOM
- Datasheets
- XC3S2000-5FGG676C
FPGAs AMD Xilinx XC3S2000-5FGG676C Overview
Introducing the AMD Xilinx XC3S2000-5FGG676C, a highly capable FPGA (Field Programmable Gate Array) that stands out in the tech industry for its robust performance and versatility. This advanced IC FPGA, housed in a 676FBGA package, supports an extensive array of 489 I/Os, making it ideally suited for complex digital circuits that require high-speed signal processing and substantial data management. This product is designed to meet the demanding needs of modern digital applications, ensuring both scalability and efficiency in system design. The FPGAs AMD Xilinx XC3S2000-5FGG676C offers a perfect blend of power, performance, and flexibility, making it a preferred choice for designers looking to push the boundaries of technology.
XC3S2000-5FGG676C Features
The XC3S2000-5FGG676C from AMD Xilinx is equipped with numerous features that make it a top contender in its class. These include a high-density integration capable of supporting complex algorithm implementations and multi-functional systems on a single chip. Its flexible I/O interfacing supports a wide range of peripheral devices, enhancing system capabilities. The chip also features advanced security protocols to protect intellectual property during deployment, making it suitable for sensitive and critical applications.
XC3S2000-5FGG676C Applications
- Telecommunications: This FPGA is widely used in the telecom sector for routing and signal processing, providing the necessary speed and flexibility for network equipment and infrastructure.
- Automotive: In automotive technology, the XC3S2000-5FGG676C helps in managing complex driver assistance systems (ADAS), integrating various sensor data inputs into a cohesive system.
- Data Centers: Ideal for data processing tasks, this FPGA accelerates database management and data processing tasks, significantly enhancing data center efficiency.
- Consumer Electronics: Applied in devices such as high-resolution video cameras, the chip supports advanced image processing algorithms for clearer video outputs.
- Aerospace and Defense: Due to its robustness and ability to operate under extreme conditions, this FPGA is crucial for applications requiring high-level data encryption and real-time processing.
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