XC3S2000-5FGG456C

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Mfr.Part #
XC3S2000-5FGG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 333 I/O 456FBGA
Stock
23
In Stock :
23

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Package / Case :
456-BBGA
Total RAM Bits :
737280
ECCN Code :
3A991.D
Factory Lead Time :
10 Weeks
Operating Supply Voltage :
1.2V
Number of Terminations :
456
RoHS Status :
ROHS3 Compliant
Number of LABs/CLBs :
5120
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e1
Voltage - Supply :
1.14V~1.26V
Number of Logic Elements/Cells :
46080
Height Seated (Max) :
2.6mm
Time@Peak Reflow Temperature-Max (s) :
30
Width :
23mm
Packaging :
Tray
Terminal Position :
BOTTOM
Pbfree Code :
yes
Published :
2009
Operating Temperature :
0°C~85°C TJ
Peak Reflow Temperature (Cel) :
250
RAM Size :
90kB
Number of Pins :
456
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
333
Series :
Spartan®-3
Speed Grade :
5
Pin Count :
456
Qualification Status :
Not Qualified
Length :
23mm
Number of Outputs :
333
Supply Voltage :
1.2V
Mount :
Surface Mount
Mounting Type :
Surface Mount
Terminal Pitch :
1mm
Base Part Number :
XC3S2000
Number of Gates :
2000000
Datasheets
XC3S2000-5FGG456C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-5FGG456C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:456-BBGA, Number of Terminations:456, Operating Temperature:0°C~85°C TJ, Number of Pins:456, Mounting Type:Surface Mount, Base Part Number:XC3S2000, XC3S2000-5FGG456C pinout, XC3S2000-5FGG456C datasheet PDF, XC3S2000-5FGG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-5FGG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S2000-5FGG456C


FPGAs AMD Xilinx XC3S2000-5FGG456C Overview

Introducing the AMD Xilinx XC3S2000-5FGG456C, a state-of-the-art Field Programmable Gate Array (FPGA) that embodies a blend of high performance, flexibility, and integration suited for sophisticated digital processing needs. This device is tailored for designers who demand high I/O interfacing and substantial logic capacity. Manufactured by the industry-leading AMD Xilinx, the XC3S2000-5FGG456C leverages advanced technology to deliver unparalleled functionality that supports complex, next-generation applications. Its design efficiency and scalability make it an ideal choice for high-volume productions across various industries.

XC3S2000-5FGG456C Features

The XC3S2000-5FGG456C FPGA offers a comprehensive feature set that includes 333 I/O pins, packaged in a compact 456FBGA format. It supports a wide range of standard and advanced communication protocols, ensuring high levels of data transfer and signal integrity. Additionally, its robust configuration options facilitate customizable integration, allowing engineers to tailor solutions specific to their application requirements.

XC3S2000-5FGG456C Applications

  • Telecommunications: Utilized in infrastructure such as routers and switches, enabling high-speed data transmission and advanced signal processing.
  • Aerospace and Defense: Critical in systems requiring high levels of reliability and programmability, such as satellite communications and avionic controls.
  • Automotive: Employs sophisticated driver assistance systems (ADAS) by processing inputs from multiple sensors for real-time decision making.
  • Consumer Electronics: Drives the development of feature-rich multimedia products such as high-definition video processing devices and virtual reality systems.
  • Industrial Automation: Key component in control systems, improving operational efficiency and precision in complex machinery and robotic systems.
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