XC3S2000-5FG676C

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Mfr.Part #
XC3S2000-5FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 489 I/O 676FCBGA
Stock
1
In Stock :
1

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Bulk
Pin Count :
676
Number of LABs/CLBs :
5120
Width :
27mm
Peak Reflow Temperature (Cel) :
225
Series :
Spartan®-3
Reach Compliance Code :
not_compliant
Number of Gates :
2000000
Number of I/O :
489
JESD-30 Code :
S-PBGA-B676
Operating Temperature :
0°C~85°C TJ
Mounting Type :
Surface Mount
Pbfree Code :
No
Number of Terminations :
676
Time@Peak Reflow Temperature-Max (s) :
30
Supply Voltage :
1.2V
Terminal Finish :
Tin/Lead (Sn63Pb37)
Terminal Pitch :
1mm
Height Seated (Max) :
2.6mm
Length :
27mm
Number of Outputs :
489
ECCN Code :
3A991.D
Total RAM Bits :
737280
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
Non-RoHS Compliant
Terminal Position :
BOTTOM
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RAM Size :
90kB
Qualification Status :
Not Qualified
Number of Inputs :
489
Surface Mount :
yes
Factory Lead Time :
10 Weeks
Voltage - Supply :
1.14V~1.26V
Number of Logic Elements/Cells :
46080
Package / Case :
676-BBGA, FCBGA
Operating Supply Voltage :
1.2V
Speed Grade :
5
Published :
2009
JESD-609 Code :
e0
Terminal Form :
Ball
Datasheets
XC3S2000-5FG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-5FG676C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Number of Terminations:676, Package / Case:676-BBGA, FCBGA, XC3S2000-5FG676C pinout, XC3S2000-5FG676C datasheet PDF, XC3S2000-5FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-5FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S2000-5FG676C


FPGAs AMD Xilinx XC3S2000-5FG676C Overview

Introducing the FPGAs AMD Xilinx XC3S2000-5FG676C, a high-performance, field-programmable gate array designed to meet the demanding requirements of modern electronic applications. Manufactured by AMD Xilinx, this IC FPGA is encapsulated in a 676-pin FCBGA package, providing robust support for a variety of complex digital circuits with its 489 I/O capabilities. The XC3S2000-5FG676C is ideal for designers seeking a scalable, flexible solution that can adapt to multiple functionalities while minimizing time-to-market. Its sophisticated architecture allows for efficient reconfiguration, making it a preferred choice for projects that require quick adaptation and deployment of new algorithms and processes.

XC3S2000-5FG676C Features

The XC3S2000-5FG676C is equipped with a rich set of features including a large array of programmable logic cells, extensive I/O options, and advanced security protocols. These features make it an excellent choice for handling complex digital computations and ensuring secure data management in a compact form factor.

XC3S2000-5FG676C Applications

  • Telecommunications Equipment: Utilizes its high I/O capacity and flexibility to manage signal processing tasks and data flow control in routers and switches.
  • Consumer Electronics: Supports advanced digital functionalities in devices such as high-definition televisions and gaming consoles, ensuring optimal performance and flexibility.
  • Automotive Systems: Ideal for automotive applications, including infotainment systems and advanced driver-assistance systems (ADAS), where reliability and adaptability are crucial.
  • Industrial Automation: Helps to streamline processes in automated machinery and robotics by providing customizable logic solutions that can adapt to varied industrial needs.
  • Medical Devices: Assists in the operation of complex medical imaging devices such as MRI and ultrasound scanners, offering the necessary computation power and flexibility.
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