XC3S2000-4FGG676C

Manufacturer :

AMD Xilinx

Product Category :

FPGAs (Field Programmable Gate Array)

Power Supplies :

1.21.2/3.32.5V

RAM Size :

90kB

Supply Voltage :

1.2V

Programmable Logic Type :

FIELD PROGRAMMABLE GATE ARRAY

JESD-609 Code :

e1

Operating Temperature :

0°C~85°C TJ

Terminal Position :

BOTTOM

Operating Supply Voltage :

1.2V

Published :

2009

Peak Reflow Temperature (Cel) :

250

Number of Gates :

2000000

Combinatorial Delay of a CLB-Max :

0.61 ns

Mounting Type :

Surface Mount

Pbfree Code :

yes

Height Seated (Max) :

2.6mm

Time@Peak Reflow Temperature-Max (s) :

30

Series :

Spartan®-3

Mount :

Surface Mount

Qualification Status :

Not Qualified

Package / Case :

676-BGA

Terminal Form :

Ball

Number of Terminations :

676

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Total RAM Bits :

737280

Number of LABs/CLBs :

5120

Length :

27mm

Width :

27mm

RoHS Status :

ROHS3 Compliant

Speed Grade :

4

Number of I/O :

489

Number of Pins :

676

Packaging :

Tray

Factory Lead Time :

10 Weeks

ECCN Code :

3A991.D

Base Part Number :

XC3S2000

Pin Count :

676

Terminal Pitch :

1mm

Clock Frequency :

630MHz

Number of Outputs :

489

Voltage - Supply :

1.14V~1.26V

Number of Logic Elements/Cells :

46080