XC3S2000-4FGG456C

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Mfr.Part #
XC3S2000-4FGG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 333 I/O 456FBGA
Stock
1,114
In Stock :
1,114

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Power Supplies :
1.21.2/3.32.5V
Number of Outputs :
333
Voltage - Supply :
1.14V~1.26V
Mount :
Surface Mount
Terminal Form :
Ball
Number of Terminations :
456
Clock Frequency :
630MHz
Speed Grade :
4
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
46080
Total RAM Bits :
737280
Number of Pins :
456
Supply Voltage :
1.2V
Peak Reflow Temperature (Cel) :
250
Pbfree Code :
yes
Number of LABs/CLBs :
5120
ECCN Code :
3A991.D
Number of I/O :
333
Length :
23mm
Package / Case :
456-BBGA
Packaging :
Tray
Terminal Pitch :
1mm
Pin Count :
456
JESD-609 Code :
e1
Operating Temperature :
0°C~85°C TJ
Combinatorial Delay of a CLB-Max :
0.61 ns
RoHS Status :
ROHS3 Compliant
Number of Gates :
2000000
Mounting Type :
Surface Mount
Series :
Spartan®-3
Terminal Position :
BOTTOM
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s) :
30
Width :
23mm
RAM Size :
90kB
Base Part Number :
XC3S2000
Published :
2001
Factory Lead Time :
10 Weeks
Height Seated (Max) :
2.6mm
Qualification Status :
Not Qualified
Operating Supply Voltage :
1.2V
Datasheets
XC3S2000-4FGG456C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-4FGG456C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:456, Number of Pins:456, Package / Case:456-BBGA, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:XC3S2000, XC3S2000-4FGG456C pinout, XC3S2000-4FGG456C datasheet PDF, XC3S2000-4FGG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-4FGG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S2000-4FGG456C


FPGAs AMD Xilinx XC3S2000-4FGG456C Overview

The AMD Xilinx XC3S2000-4FGG456C, part of the robust family of FPGAs (Field Programmable Gate Arrays), is designed to meet the high demands of modern digital applications. With a versatile 456-pin FBGA package, this FPGA excels in delivering high-performance, programmability, and flexibility necessary for complex circuit designs. This component offers an outstanding solution for designers looking to push the boundaries of hardware acceleration, signal processing, and system integration. The inclusion of 333 I/O points provides ample connectivity for wide-ranging applications, making the FPGAs AMD Xilinx XC3S2000-4FGG456C a cornerstone in the development of advanced technology solutions.

XC3S2000-4FGG456C Features

The XC3S2000-4FGG456C FPGA is equipped with numerous features that enhance its utility and efficiency in various applications. Key features include a high I/O pin count, a large user-configurable gate array, and support for multiple logic configurations. This flexibility allows it to adapt to changes in system requirements and technologies, ensuring long-term relevance in a fast-evolving technological landscape.

XC3S2000-4FGG456C Applications

  • Telecommunications Infrastructure: The XC3S2000-4FGG456C can be utilized in developing base station equipment, facilitating enhanced signal processing capabilities and better network efficiency.
  • Automotive Electronics: This FPGA is suitable for use in automotive safety systems, offering the necessary processing power for real-time sensor data analysis and decision-making processes.
  • Consumer Electronics: The XC3S2000-4FGG456C can drive innovation in consumer electronics, such as smart home devices and advanced entertainment systems, by providing a flexible platform for multimedia processing and connectivity.
  • Industrial Automation: In industrial settings, this FPGA aids in controlling machinery and processes, improving operational efficiency and safety through precise control and monitoring systems.
  • Medical Devices: It also finds applications in medical imaging systems, where high data throughput and processing capabilities are crucial for detailed imaging and diagnostics.
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