XC3S2000-4FG676I

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Mfr.Part #
XC3S2000-4FG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 489 I/O 676FCBGA
Stock
38,779
In Stock :
38,779

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Pitch :
1mm
Factory Lead Time :
10 Weeks
Series :
Spartan®-3
Packaging :
Bulk
Voltage - Supply :
1.14V~1.26V
Surface Mount :
yes
JESD-30 Code :
S-PBGA-B676
Clock Frequency :
630MHz
Peak Reflow Temperature (Cel) :
225
Pin Count :
676
Published :
2009
Number of Gates :
2000000
RAM Size :
90kB
Combinatorial Delay of a CLB-Max :
0.61 ns
Terminal Position :
BOTTOM
Length :
27mm
Reach Compliance Code :
not_compliant
Width :
27mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Number of LABs/CLBs :
5120
Pbfree Code :
No
Number of Terminations :
676
Total RAM Bits :
737280
Qualification Status :
Not Qualified
Number of I/O :
489
RoHS Status :
Non-RoHS Compliant
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Supply Voltage :
1.2V
Time@Peak Reflow Temperature-Max (s) :
30
Package / Case :
676-BBGA, FCBGA
Number of Logic Elements/Cells :
46080
ECCN Code :
3A991.D
Height Seated (Max) :
2.6mm
Power Supplies :
1.21.2/3.32.5V
Number of Outputs :
489
Terminal Finish :
Tin/Lead (Sn63Pb37)
Number of Inputs :
489
JESD-609 Code :
e0
Terminal Form :
Ball
Supply Voltage :
1.2V
Speed Grade :
4
Operating Temperature :
-40°C~100°C TJ
Datasheets
XC3S2000-4FG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-4FG676I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:676, Package / Case:676-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XC3S2000-4FG676I pinout, XC3S2000-4FG676I datasheet PDF, XC3S2000-4FG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-4FG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S2000-4FG676I


FPGAs AMD Xilinx XC3S2000-4FG676I Overview

The FPGAs AMD Xilinx XC3S2000-4FG676I is a high-performance, field-programmable gate array designed for advanced embedded applications. Developed by AMD Xilinx, this IC features a robust 489 I/O count packaged efficiently in a 676FCBGA form factor. It caters specifically to developers needing extensive programmability and high-speed digital processing capabilities. The XC3S2000-4FG676I is ideally suited for applications demanding high throughput and maximum flexibility, enabling complex logic designs that can be customized post-production.

XC3S2000-4FG676I Features

This FPGA model boasts a range of features that enhance its utility in complex digital environments. It includes a dense array of programmable logic cells, a high I/O count for extensive connectivity, and support for various logic configurations. Additionally, the integration into a 676-pin fine-pitch ball grid array (FCBGA) ensures minimized latency and improved heat dissipation, critical for maintaining performance in rigorous operational conditions.

XC3S2000-4FG676I Applications

  • Telecommunications: Employed in network infrastructure to manage signal processing and data flow efficiently, enhancing system reliability and performance.
  • Automotive Systems: Integral to advanced driver-assistance systems (ADAS), providing the necessary computing power to process real-time data from vehicle sensors.
  • Consumer Electronics: Used in high-definition multimedia interfaces and advanced video processing units for clearer, faster visual output.
  • Industrial Automation: Powers complex machinery control systems, enabling precision and adaptability in manufacturing processes.
  • Aerospace and Defense: Critical for navigation and control systems where robustness and adaptability are paramount.
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