XC3S2000-4FG676I
- Mfr.Part #
- XC3S2000-4FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 489 I/O 676FCBGA
- Stock
- 38,779
- In Stock :
- 38,779
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Surface Mount :
- yes
- Mounting Type :
- Surface Mount
- ECCN Code :
- 3A991.D
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 676
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Package / Case :
- 676-BBGA, FCBGA
- Supply Voltage :
- 1.2V
- JESD-609 Code :
- e0
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Pin Count :
- 676
- Series :
- Spartan®-3
- Pbfree Code :
- No
- Total RAM Bits :
- 737280
- Reach Compliance Code :
- not_compliant
- Packaging :
- Bulk
- Operating Supply Voltage :
- 1.2V
- RAM Size :
- 90kB
- Number of I/O :
- 489
- Terminal Pitch :
- 1mm
- Number of Inputs :
- 489
- Number of Logic Elements/Cells :
- 46080
- Published :
- 2009
- RoHS Status :
- Non-RoHS Compliant
- Number of LABs/CLBs :
- 5120
- Height Seated (Max) :
- 2.6mm
- Clock Frequency :
- 630MHz
- Number of Outputs :
- 489
- Operating Temperature :
- -40°C~100°C TJ
- JESD-30 Code :
- S-PBGA-B676
- Terminal Form :
- Ball
- Width :
- 27mm
- Voltage - Supply :
- 1.14V~1.26V
- Power Supplies :
- 1.21.2/3.32.5V
- Factory Lead Time :
- 10 Weeks
- Speed Grade :
- 4
- Peak Reflow Temperature (Cel) :
- 225
- Qualification Status :
- Not Qualified
- Number of Gates :
- 2000000
- Length :
- 27mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XC3S2000-4FG676I

FPGAs AMD Xilinx XC3S2000-4FG676I Overview
The FPGAs AMD Xilinx XC3S2000-4FG676I is a high-performance, field-programmable gate array designed for advanced embedded applications. Developed by AMD Xilinx, this IC features a robust 489 I/O count packaged efficiently in a 676FCBGA form factor. It caters specifically to developers needing extensive programmability and high-speed digital processing capabilities. The XC3S2000-4FG676I is ideally suited for applications demanding high throughput and maximum flexibility, enabling complex logic designs that can be customized post-production.
XC3S2000-4FG676I Features
This FPGA model boasts a range of features that enhance its utility in complex digital environments. It includes a dense array of programmable logic cells, a high I/O count for extensive connectivity, and support for various logic configurations. Additionally, the integration into a 676-pin fine-pitch ball grid array (FCBGA) ensures minimized latency and improved heat dissipation, critical for maintaining performance in rigorous operational conditions.
XC3S2000-4FG676I Applications
- Telecommunications: Employed in network infrastructure to manage signal processing and data flow efficiently, enhancing system reliability and performance.
- Automotive Systems: Integral to advanced driver-assistance systems (ADAS), providing the necessary computing power to process real-time data from vehicle sensors.
- Consumer Electronics: Used in high-definition multimedia interfaces and advanced video processing units for clearer, faster visual output.
- Industrial Automation: Powers complex machinery control systems, enabling precision and adaptability in manufacturing processes.
- Aerospace and Defense: Critical for navigation and control systems where robustness and adaptability are paramount.
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