XC3S2000-4FG676C
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- Mfr.Part #
- XC3S2000-4FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 489 I/O 676FCBGA
- Stock
- 2,196
- In Stock ：
- 2,196
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Pin Count :
- 676
- Length :
- 27mm
- Height Seated (Max) :
- 2.6mm
- RAM Size :
- 90kB
- Terminal Form :
- Ball
- Number of Gates :
- 2000000
- Surface Mount :
- yes
- Width :
- 27mm
- Published :
- 2009
- RoHS Status :
- Non-RoHS Compliant
- Terminal Pitch :
- 1mm
- Number of LABs/CLBs :
- 5120
- ECCN Code :
- 3A991.D
- Number of Terminations :
- 676
- Number of Inputs :
- 489
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- No
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 737280
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Peak Reflow Temperature (Cel) :
- 225
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Clock Frequency :
- 630MHz
- Factory Lead Time :
- 10 Weeks
- Number of Logic Elements/Cells :
- 46080
- Package / Case :
- 676-BBGA, FCBGA
- Series :
- Spartan®-3
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- JESD-609 Code :
- e0
- JESD-30 Code :
- S-PBGA-B676
- Reach Compliance Code :
- not_compliant
- Packaging :
- Bulk
- Power Supplies :
- 1.21.2/3.32.5V
- Number of Outputs :
- 489
- Operating Temperature :
- 0°C~85°C TJ
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Speed Grade :
- 4
- Operating Supply Voltage :
- 1.2V
- Supply Voltage :
- 1.2V
- Number of I/O :
- 489
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 1.14V~1.26V
- Datasheets
- XC3S2000-4FG676C
FPGAs AMD Xilinx XC3S2000-4FG676C Overview
The FPGAs AMD Xilinx XC3S2000-4FG676C is a high-performance, field-programmable gate array designed for advanced systems requiring high-speed digital processing and high-density integration. This FPGA, housed in a 676-pin flip-chip ball grid array (FCBGA) package, provides a robust platform for developing complex digital circuits with a flexible logic optimization capability. Its 489 I/O options facilitate extensive connectivity and interoperability with a wide range of other electronic components, making it a versatile choice for designers aiming to push the boundaries of technology in various applications. The FPGAs AMD Xilinx XC3S2000-4FG676C is an excellent solution for engineers looking to leverage speed and integration without compromising on power efficiency and cost.
XC3S2000-4FG676C Features
This particular model from AMD Xilinx offers numerous features that enhance its utility in designing and prototyping digital circuits:
- High-density integration capability to accommodate complex algorithms and logic designs.
- 489 input/output pins to support extensive external connections.
- Packaged in a 676-pin FCBGA, optimizing it for robust performance and reliability.
- Adaptable logic blocks for customizable circuit design.
- Efficient power management for enhanced sustainability and reduced operational costs.
XC3S2000-4FG676C Applications
- Telecommunications Equipment:
Utilized in the development of routers and switches, the XC3S2000-4FG676C manages complex data algorithms essential for network traffic management and signal integrity.
- Automotive Systems:
Supports advanced driver-assistance systems (ADAS) by processing multiple sensor data streams, enhancing vehicle safety and performance.
- Medical Imaging Devices:
Integral in processing and reconstructing imaging data, thereby ensuring high-resolution outputs in devices such as MRI and ultrasound machines.
- Industrial Automation:
Empowers control systems to perform real-time analysis and automation tasks, crucial for optimizing manufacturing processes and improving operational efficiency.
- Consumer Electronics:
Drives the functionality in smart home devices and entertainment systems by managing multiple user inputs and multimedia interfaces simultaneously.
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