XC3S2000-4FG456C

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Mfr.Part #
XC3S2000-4FG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 333 I/O 456FBGA
Stock
1,204
In Stock :
1,204

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
5120
Series :
Spartan®-3
Packaging :
Bulk
Number of I/O :
333
Operating Supply Voltage :
1.2V
Package / Case :
456-BBGA
Min Operating Temperature :
0°C
Operating Temperature :
0°C~85°C TJ
Number of Gates :
2000000
Supplier Device Package :
456-FBGA (23x23)
RoHS Status :
Non-RoHS Compliant
Factory Lead Time :
10 Weeks
RAM Size :
90kB
Published :
2009
Total RAM Bits :
737280
Voltage - Supply :
1.14V~1.26V
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
46080
Max Operating Temperature :
85°C
Speed Grade :
4
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Datasheets
XC3S2000-4FG456C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-4FG456C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:456-BBGA, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, XC3S2000-4FG456C pinout, XC3S2000-4FG456C datasheet PDF, XC3S2000-4FG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S2000-4FG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S2000-4FG456C


FPGAs AMD Xilinx XC3S2000-4FG456C Overview

The FPGAs AMD Xilinx XC3S2000-4FG456C is a high-performance, field-programmable gate array that is designed to meet the needs of demanding applications requiring high I/O bandwidth and logic density. This IC, housed in a 456-pin FBGA package, supports a wide array of functionalities with its 333 I/O pins, making it highly versatile for a variety of industrial, communication, and technology applications. Its robust configuration allows for optimal customization, which is critical in rapidly evolving tech environments. By leveraging AMD Xilinx's advanced technology, the XC3S2000-4FG456C ensures reliability and high performance, which are essential for developers looking to scale their operations and accelerate time-to-market.

XC3S2000-4FG456C Features

The XC3S2000-4FG456C FPGA is packed with features designed for efficient and flexible application deployment. Key features include a large number of input/output options, a compact 456FBGA package for reduced board space, and support for multiple configuration schemes. These capabilities make it an excellent choice for designers seeking a balance between performance and power consumption, offering significant advantages in customizable electronics design.

XC3S2000-4FG456C Applications

  • Telecommunications Equipment: Utilizes its high I/O capacity for managing multiple data streams and signal processing tasks, enhancing the performance and reliability of communications systems.
  • Data Processing Systems: Employs its extensive logic capacity to handle complex algorithms and computations required in high-speed data environments.
  • Consumer Electronics: Integrates into devices such as high-definition televisions and gaming consoles to improve processing power and video output capabilities.
  • Automotive Applications: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors for real-time decision making.
  • Industrial Automation: Adapts easily to control systems requiring high-speed data acquisition and real-time processing for automated manufacturing processes.
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