XC3S2000-4FG456C
- Mfr.Part #
- XC3S2000-4FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 333 I/O 456FBGA
- Stock
- 1,204
- In Stock :
- 1,204
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of LABs/CLBs :
- 5120
- Series :
- Spartan®-3
- Packaging :
- Bulk
- Number of I/O :
- 333
- Operating Supply Voltage :
- 1.2V
- Package / Case :
- 456-BBGA
- Min Operating Temperature :
- 0°C
- Operating Temperature :
- 0°C~85°C TJ
- Number of Gates :
- 2000000
- Supplier Device Package :
- 456-FBGA (23x23)
- RoHS Status :
- Non-RoHS Compliant
- Factory Lead Time :
- 10 Weeks
- RAM Size :
- 90kB
- Published :
- 2009
- Total RAM Bits :
- 737280
- Voltage - Supply :
- 1.14V~1.26V
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 46080
- Max Operating Temperature :
- 85°C
- Speed Grade :
- 4
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- XC3S2000-4FG456C

FPGAs AMD Xilinx XC3S2000-4FG456C Overview
The FPGAs AMD Xilinx XC3S2000-4FG456C is a high-performance, field-programmable gate array that is designed to meet the needs of demanding applications requiring high I/O bandwidth and logic density. This IC, housed in a 456-pin FBGA package, supports a wide array of functionalities with its 333 I/O pins, making it highly versatile for a variety of industrial, communication, and technology applications. Its robust configuration allows for optimal customization, which is critical in rapidly evolving tech environments. By leveraging AMD Xilinx's advanced technology, the XC3S2000-4FG456C ensures reliability and high performance, which are essential for developers looking to scale their operations and accelerate time-to-market.
XC3S2000-4FG456C Features
The XC3S2000-4FG456C FPGA is packed with features designed for efficient and flexible application deployment. Key features include a large number of input/output options, a compact 456FBGA package for reduced board space, and support for multiple configuration schemes. These capabilities make it an excellent choice for designers seeking a balance between performance and power consumption, offering significant advantages in customizable electronics design.
XC3S2000-4FG456C Applications
- Telecommunications Equipment: Utilizes its high I/O capacity for managing multiple data streams and signal processing tasks, enhancing the performance and reliability of communications systems.
- Data Processing Systems: Employs its extensive logic capacity to handle complex algorithms and computations required in high-speed data environments.
- Consumer Electronics: Integrates into devices such as high-definition televisions and gaming consoles to improve processing power and video output capabilities.
- Automotive Applications: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors for real-time decision making.
- Industrial Automation: Adapts easily to control systems requiring high-speed data acquisition and real-time processing for automated manufacturing processes.
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