XC3S200-5FTG256C

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Mfr.Part #
XC3S200-5FTG256C
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 173 I/O 256FTBGA
Stock
41,397
In Stock :
41,397

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Number of Terminations :
256
RoHS Status :
ROHS3 Compliant
Package / Case :
256-LBGA
Length :
17mm
Number of Logic Elements/Cells :
4320
ECCN Code :
EAR99
Qualification Status :
Not Qualified
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e1
Mount :
Surface Mount
Published :
2006
Pin Count :
256
Terminal Pitch :
1mm
Operating Supply Voltage :
1.2V
Speed Grade :
5
Mounting Type :
Surface Mount
Factory Lead Time :
10 Weeks
RAM Size :
27kB
Width :
17mm
Number of Outputs :
173
Operating Temperature :
0°C~85°C TJ
Series :
Spartan®-3
Peak Reflow Temperature (Cel) :
260
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Base Part Number :
XC3S200
Number of Gates :
200000
Packaging :
Tray
Number of I/O :
173
Number of Pins :
256
Supply Voltage :
1.2V
Number of LABs/CLBs :
480
Number of CLBs :
480
Time@Peak Reflow Temperature-Max (s) :
30
Pbfree Code :
yes
Terminal Position :
BOTTOM
Voltage - Supply :
1.14V~1.26V
Total RAM Bits :
221184
Datasheets
XC3S200-5FTG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S200-5FTG256C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:256, Package / Case:256-LBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Base Part Number:XC3S200, Number of Pins:256, XC3S200-5FTG256C pinout, XC3S200-5FTG256C datasheet PDF, XC3S200-5FTG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S200-5FTG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S200-5FTG256C


FPGAs AMD Xilinx XC3S200-5FTG256C Overview

The FPGAs AMD Xilinx XC3S200-5FTG256C is an advanced field programmable gate array designed for versatile applications requiring high-speed digital processing and flexible hardware customization. This FPGA features a robust architecture courtesy of AMD Xilinx, delivering exceptional performance in a compact 256FTBGA package. Its integration capabilities make it an ideal choice for developers and engineers looking for a reliable, high-performance solution to drive innovation in technology-heavy industries. The XC3S200-5FTG256C excels in environments demanding quick reprogramming and adaptability to evolving technical requirements, reinforcing its utility in complex digital circuits and systems.

XC3S200-5FTG256C Features

The XC3S200-5FTG256C FPGA includes 173 I/O pins, allowing for extensive connectivity and interfacing with a wide range of peripheral devices. Housed in a 256-pin fine-pitch ball grid array (FTBGA), it offers a compact form factor ideal for space-constrained applications while still providing the capability for robust data management and signal processing. This product also supports various logic optimization techniques, which enhance its efficiency and performance in multifaceted applications.

XC3S200-5FTG256C Applications

  • Consumer Electronics: Utilized in devices like smart TVs and gaming consoles, the XC3S200-5FTG256C enhances processing capabilities and supports advanced user interfaces and connectivity options.
  • Automotive Systems: Integral in driver assistance systems, this FPGA processes multiple real-time inputs to provide quick decision-making solutions, improving safety and vehicle dynamics.
  • Communication Infrastructure: Deployed in network routers and switches, it manages data flow efficiently, ensuring reliable and fast network performance essential in modern telecommunication setups.
  • Industrial Automation: In industrial environments, the XC3S200-5FTG256C automates complex tasks, from assembly line control to robotic operations, enhancing productivity and operational efficiency.
  • Medical Equipment: Key in medical diagnostic devices, this FPGA handles vast amounts of data from imaging equipment, contributing to faster and more accurate diagnostics.
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