XC3S200-4FTG256I

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Mfr.Part #
XC3S200-4FTG256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 173 I/O 256FTBGA
Stock
27,227
In Stock :
27,227

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
1.14V~1.26V
Pbfree Code :
yes
Base Part Number :
XC3S200
Qualification Status :
Not Qualified
Power Supplies :
1.21.2/3.32.5V
Published :
2006
JESD-609 Code :
e1
Number of Outputs :
173
Number of Logic Elements/Cells :
4320
Number of LABs/CLBs :
480
Number of Pins :
256
Number of I/O :
173
Number of CLBs :
480
Packaging :
Tray
Peak Reflow Temperature (Cel) :
260
Operating Supply Voltage :
1.2V
Mounting Type :
Surface Mount
Number of Gates :
200000
ECCN Code :
EAR99
Speed Grade :
4
Height Seated (Max) :
1.55mm
Length :
17mm
Pin Count :
256
Terminal Form :
Ball
Series :
Spartan®-3
Operating Temperature :
-40°C~100°C TJ
RoHS Status :
ROHS3 Compliant
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Factory Lead Time :
10 Weeks
Total RAM Bits :
221184
Clock Frequency :
630MHz
Supply Voltage :
1.2V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Terminations :
256
RAM Size :
27kB
Package / Case :
256-LBGA
Time@Peak Reflow Temperature-Max (s) :
30
Width :
17mm
Mount :
Surface Mount
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Combinatorial Delay of a CLB-Max :
0.61 ns
Datasheets
XC3S200-4FTG256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S200-4FTG256I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC3S200, Number of Pins:256, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Terminations:256, Package / Case:256-LBGA, XC3S200-4FTG256I pinout, XC3S200-4FTG256I datasheet PDF, XC3S200-4FTG256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S200-4FTG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S200-4FTG256I


FPGAs AMD Xilinx XC3S200-4FTG256I Overview

The FPGAs AMD Xilinx XC3S200-4FTG256I is a highly capable field-programmable gate array (FPGA) designed for robust and flexible digital circuit development. Manufactured by AMD Xilinx, this component features a dense 256FTBGA package, making it an ideal choice for sophisticated electronic applications that require a combination of compact design and powerful performance. This product leverages the innovative FPGA technology to provide significant advantages in programmability, speed, and efficiency, making it highly sought after for advanced technological solutions.

XC3S200-4FTG256I Features

The XC3S200-4FTG256I is equipped with 173 I/O pins, providing ample connectivity options for various peripheral devices. This FPGA supports a wide range of digital signaling which ensures versatile integration with both legacy and cutting-edge technologies. Its robust packaging in a 256FTBGA format ensures that it can operate reliably in diverse environmental conditions, including those that involve high levels of mechanical stress or thermal variation.

XC3S200-4FTG256I Applications

  • Industrial Automation: This FPGA can be integrated into control systems for machinery and production lines, enhancing operational efficiency and reliability.
  • Automotive Systems: Useful in advanced driver-assistance systems (ADAS), the XC3S200-4FTG256I manages sensor inputs and real-time vehicle data processing.
  • Consumer Electronics: Ideal for high-performance, multi-function devices such as smart home systems and portable electronics where space and power efficiency are critical.
  • Telecommunications: Serves as a core component in communication infrastructure, facilitating improved data transmission and signal processing capabilities.
  • Medical Devices: Applied in medical imaging systems and diagnostic equipment, ensuring precise and quick processing of critical patient data.
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