XC3S200-4FT256I
- Mfr.Part #
- XC3S200-4FT256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 173 I/O 256FTBGA
- Stock
- 15,960
- In Stock :
- 15,960
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 1.55mm
- Factory Lead Time :
- 10 Weeks
- ECCN Code :
- EAR99
- Published :
- 2006
- Packaging :
- Bulk
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 17mm
- Total RAM Bits :
- 221184
- Qualification Status :
- Not Qualified
- Mount :
- Standard
- Series :
- Spartan®-3
- Power Supplies :
- 1.21.2/3.32.5V
- RAM Size :
- 27kB
- Terminal Form :
- Ball
- Number of Gates :
- 200000
- Length :
- 17mm
- Number of CLBs :
- 480
- RoHS Status :
- Non-RoHS Compliant
- Pbfree Code :
- No
- Reach Compliance Code :
- not_compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 1.2V
- Package / Case :
- 256-LBGA
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 1.14V~1.26V
- Peak Reflow Temperature (Cel) :
- 240
- Terminal Pitch :
- 1mm
- Number of I/O :
- 173
- Operating Supply Voltage :
- 1.2V
- Pin Count :
- 256
- Speed Grade :
- 4
- Number of LABs/CLBs :
- 480
- Operating Temperature :
- -40°C~100°C TJ
- Number of Outputs :
- 173
- Clock Frequency :
- 630MHz
- Number of Logic Elements/Cells :
- 4320
- Number of Pins :
- 256
- Number of Terminations :
- 256
- JESD-609 Code :
- e0
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Datasheets
- XC3S200-4FT256I

FPGAs AMD Xilinx XC3S200-4FT256I Overview
The FPGAs AMD Xilinx XC3S200-4FT256I is an exceptional integrated circuit, specifically engineered by AMD Xilinx to cater to the advanced needs of modern digital systems. This FPGA is housed in a 256FTBGA package, featuring a robust set of 173 I/O pins, which makes it highly adaptable for a variety of demanding applications. Its design focuses on delivering high-performance, reliability, and flexibility, thus making it an ideal choice for developers looking to push the boundaries of technology with their projects. The XC3S200-4FT256I leverages advanced silicon technology to offer efficient power consumption and heat dissipation, ensuring stable performance across diverse operational environments.
XC3S200-4FT256I Features
The XC3S200-4FT256I FPGA boasts several features that stand out in the field of programmable logic solutions. Key features include a high-density, low-power FPGA architecture, advanced security through encrypted configuration streams, and support for multi-voltage operation. These features make it particularly suitable for applications that require high-speed data processing and secure operation in a compact footprint.
XC3S200-4FT256I Applications
- Telecommunications: Used in networking hardware such as routers and switches for fast and efficient data handling and traffic management.
- Automotive Systems: Can be integrated into automotive electronics for control systems and driver assistance features, enhancing vehicle responsiveness and safety.
- Industrial Automation: Ideal for use in control systems in manufacturing lines, improving automation precision and reliability.
- Consumer Electronics: Applies to the development of consumer electronics, such as high-performance gaming consoles and home entertainment systems, where speed and reliability are paramount.
- Medical Devices: Useful in medical diagnostic equipment where quick and accurate processing of large volumes of data is crucial for effective treatment planning.
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