XC3S200-4FT256I

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Mfr.Part #
XC3S200-4FT256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 173 I/O 256FTBGA
Stock
15,960
In Stock :
15,960

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Height Seated (Max) :
1.55mm
Factory Lead Time :
10 Weeks
ECCN Code :
EAR99
Published :
2006
Packaging :
Bulk
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Width :
17mm
Total RAM Bits :
221184
Qualification Status :
Not Qualified
Mount :
Standard
Series :
Spartan®-3
Power Supplies :
1.21.2/3.32.5V
RAM Size :
27kB
Terminal Form :
Ball
Number of Gates :
200000
Length :
17mm
Number of CLBs :
480
RoHS Status :
Non-RoHS Compliant
Pbfree Code :
No
Reach Compliance Code :
not_compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage :
1.2V
Package / Case :
256-LBGA
Mounting Type :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Peak Reflow Temperature (Cel) :
240
Terminal Pitch :
1mm
Number of I/O :
173
Operating Supply Voltage :
1.2V
Pin Count :
256
Speed Grade :
4
Number of LABs/CLBs :
480
Operating Temperature :
-40°C~100°C TJ
Number of Outputs :
173
Clock Frequency :
630MHz
Number of Logic Elements/Cells :
4320
Number of Pins :
256
Number of Terminations :
256
JESD-609 Code :
e0
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Position :
BOTTOM
Terminal Finish :
Tin/Lead (Sn63Pb37)
Combinatorial Delay of a CLB-Max :
0.61 ns
Datasheets
XC3S200-4FT256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S200-4FT256I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Number of Pins:256, Number of Terminations:256, XC3S200-4FT256I pinout, XC3S200-4FT256I datasheet PDF, XC3S200-4FT256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S200-4FT256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S200-4FT256I


FPGAs AMD Xilinx XC3S200-4FT256I Overview

The FPGAs AMD Xilinx XC3S200-4FT256I is an exceptional integrated circuit, specifically engineered by AMD Xilinx to cater to the advanced needs of modern digital systems. This FPGA is housed in a 256FTBGA package, featuring a robust set of 173 I/O pins, which makes it highly adaptable for a variety of demanding applications. Its design focuses on delivering high-performance, reliability, and flexibility, thus making it an ideal choice for developers looking to push the boundaries of technology with their projects. The XC3S200-4FT256I leverages advanced silicon technology to offer efficient power consumption and heat dissipation, ensuring stable performance across diverse operational environments.

XC3S200-4FT256I Features

The XC3S200-4FT256I FPGA boasts several features that stand out in the field of programmable logic solutions. Key features include a high-density, low-power FPGA architecture, advanced security through encrypted configuration streams, and support for multi-voltage operation. These features make it particularly suitable for applications that require high-speed data processing and secure operation in a compact footprint.

XC3S200-4FT256I Applications

  • Telecommunications: Used in networking hardware such as routers and switches for fast and efficient data handling and traffic management.
  • Automotive Systems: Can be integrated into automotive electronics for control systems and driver assistance features, enhancing vehicle responsiveness and safety.
  • Industrial Automation: Ideal for use in control systems in manufacturing lines, improving automation precision and reliability.
  • Consumer Electronics: Applies to the development of consumer electronics, such as high-performance gaming consoles and home entertainment systems, where speed and reliability are paramount.
  • Medical Devices: Useful in medical diagnostic equipment where quick and accurate processing of large volumes of data is crucial for effective treatment planning.
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