XC3S200-4FT256C

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Mfr.Part #
XC3S200-4FT256C
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 173 I/O 256FTBGA
Stock
44,993
In Stock :
44,993

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Factory Lead Time :
10 Weeks
Number of LABs/CLBs :
480
Mounting Type :
Surface Mount
RAM Size :
27kB
Supplier Device Package :
256-FTBGA (17x17)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Total RAM Bits :
221184
Number of Logic Elements/Cells :
4320
Voltage - Supply :
1.14V~1.26V
Mount :
Standard
Package / Case :
256-LBGA
Series :
Spartan®-3
Min Operating Temperature :
0°C
Number of I/O :
173
Published :
2004
Operating Supply Voltage :
1.2V
Operating Temperature :
0°C~85°C TJ
Packaging :
Bulk
Speed Grade :
4
Number of Pins :
256
Number of Gates :
200000
Max Operating Temperature :
85°C
RoHS Status :
Non-RoHS Compliant
Datasheets
XC3S200-4FT256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S200-4FT256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:256-LBGA, Operating Temperature:0°C~85°C TJ, Number of Pins:256, XC3S200-4FT256C pinout, XC3S200-4FT256C datasheet PDF, XC3S200-4FT256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S200-4FT256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S200-4FT256C


FPGAs AMD Xilinx XC3S200-4FT256C Overview

The AMD Xilinx XC3S200-4FT256C, part of the field-programmable gate array (FPGA) category, is a robust integrated circuit designed for high-performance applications requiring flexible and dynamic processing capabilities. This FPGA is ideal for developers looking to leverage a programmable silicon platform capable of handling complex digital computations and signal processing tasks. With its compact 256FTBGA package and a substantial array of 173 I/O pins, it offers a versatile solution for a wide range of electronic applications, from consumer electronics to industrial systems. The XC3S200-4FT256C is engineered to support rapid prototyping and development, ensuring efficiency and scalability in system design.

XC3S200-4FT256C Features

The XC3S200-4FT256C FPGA by AMD Xilinx is equipped with advanced features that enhance its adaptability and functionality in various demanding environments. These include a high-density logic gate structure for intricate logic operations, low power consumption for energy-efficient designs, and high-speed transceivers to facilitate fast data transfer. The device's reprogrammability ensures that it can be used across multiple projects and applications, making it a cost-effective choice for both prototyping and production phases.

XC3S200-4FT256C Applications

  • Consumer Electronics: Utilized in devices like smart TVs and gaming consoles, the XC3S200-4FT256C manages rapid data processing and enhances user interface responsiveness.
  • Communications: Critical in telecommunications equipment, this FPGA supports the processing of high-speed data transfers and signal integrity, ensuring reliable and efficient communication networks.
  • Automotive Systems: In automotive applications, the XC3S200-4FT256C helps manage sensor data and control systems, contributing to advancements in vehicle safety and performance.
  • Industrial Automation: This FPGA is instrumental in robotics and control systems, facilitating complex algorithms required for automation and real-time processing.
  • Medical Devices: Employed in medical imaging systems, the XC3S200-4FT256C aids in processing complex imaging data, enhancing diagnostic capabilities and patient care.
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