XC3S1600E-4FG320C
- Mfr.Part #
- XC3S1600E-4FG320C
- Manufacturer
- AMD Xilinx
- Package / Case
- 320-BGA
- Datasheet
- Download
- Description
- IC FPGA 250 I/O 320FBGA
- Stock
- 1,206
- In Stock :
- 1,206
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Package / Case :
- 320-BGA
- Length :
- 19mm
- Number of Registers :
- 29504
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- JESD-609 Code :
- e0
- Factory Lead Time :
- 10 Weeks
- JESD-30 Code :
- S-PBGA-B320
- Reach Compliance Code :
- not_compliant
- Number of LABs/CLBs :
- 3688
- Packaging :
- Bulk
- Peak Reflow Temperature (Cel) :
- 225
- Width :
- 19mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Published :
- 2007
- RAM Size :
- 81kB
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- No
- Terminal Position :
- BOTTOM
- Number of Gates :
- 1600000
- Number of Logic Elements/Cells :
- 33192
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Speed Grade :
- 4
- Pin Count :
- 320
- Power Supplies :
- 1.21.2/3.32.5V
- Total RAM Bits :
- 663552
- Mounting Type :
- Surface Mount
- Number of Inputs :
- 250
- Voltage - Supply :
- 1.14V~1.26V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Temperature :
- 0°C~85°C TJ
- Supply Voltage :
- 1.2V
- Qualification Status :
- Not Qualified
- Surface Mount :
- yes
- Terminal Pitch :
- 1mm
- ECCN Code :
- 3A991.D
- Number of Outputs :
- 194
- Number of Terminations :
- 320
- RoHS Status :
- Non-RoHS Compliant
- Operating Supply Voltage :
- 1.2V
- Height Seated (Max) :
- 2mm
- Number of I/O :
- 250
- Series :
- Spartan®-3E
- Clock Frequency :
- 572MHz
- Terminal Form :
- Ball
- Datasheets
- XC3S1600E-4FG320C

FPGAs AMD Xilinx XC3S1600E-4FG320C Overview
The FPGAs AMD Xilinx XC3S1600E-4FG320C is a highly versatile and powerful field-programmable gate array designed for applications requiring high-speed data processing and flexible hardware configuration. Manufactured by the renowned AMD Xilinx, this FPGA integrates robust features into a 320-pin FBGA package, providing a compact solution for complex digital circuits. Its advanced capabilities make it an excellent choice for designers looking to leverage speed and programmability in their systems, enhancing performance across a variety of industrial applications.
XC3S1600E-4FG320C Features
This FPGA stands out for its significant features which include 250 I/O pins, allowing extensive connectivity options for peripheral devices. The XC3S1600E-4FG320C operates efficiently with a configuration of 4 speed grades, providing flexibility and high performance in demanding applications. Its 320 FBGA packaging ensures a reduced footprint on system boards, facilitating more compact designs without compromising on functionality.
XC3S1600E-4FG320C Applications
- Telecommunications Infrastructure: Utilized in routers and switches, enhancing signal integrity and data flow management.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS) by processing multiple data streams from sensors in real time.
- Medical Imaging: Integral in the development of imaging devices such as MRI and ultrasound machines, where high-speed data processing is critical.
- Industrial Automation: Drives complex machinery control systems in manufacturing processes, increasing efficiency and precision.
- Aerospace and Defense: Used in avionics for real-time system monitoring and control in harsh environments.
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