XC3S1500-5FGG676C
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- Mfr.Part #
- XC3S1500-5FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 487 I/O 676FBGA
- Stock
- 16,254
- In Stock ：
- 16,254
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- 3A991.D
- Operating Temperature :
- 0°C~85°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 487
- Terminal Pitch :
- 1mm
- JESD-609 Code :
- e1
- Width :
- 27mm
- Number of LABs/CLBs :
- 3328
- Peak Reflow Temperature (Cel) :
- 250
- Package / Case :
- 676-BGA
- Total RAM Bits :
- 589824
- Mount :
- Surface Mount
- Factory Lead Time :
- 10 Weeks
- Number of Logic Elements/Cells :
- 29952
- RAM Size :
- 72kB
- Pin Count :
- 676
- Height Seated (Max) :
- 2.6mm
- Supply Voltage :
- 1.2V
- Length :
- 27mm
- Packaging :
- Tray
- Number of Gates :
- 1500000
- Qualification Status :
- Not Qualified
- Number of Outputs :
- 487
- Terminal Form :
- Ball
- Speed Grade :
- 5
- Number of Terminations :
- 676
- Operating Supply Voltage :
- 1.2V
- Base Part Number :
- XC3S1500
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 1.14V~1.26V
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Terminal Position :
- BOTTOM
- Number of Pins :
- 676
- Published :
- 2008
- Series :
- Spartan®-3
- Pbfree Code :
- yes
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XC3S1500-5FGG676C
FPGAs AMD Xilinx XC3S1500-5FGG676C Overview
The AMD Xilinx XC3S1500-5FGG676C FPGA is a high-performance, field-programmable gate array that delivers exceptional functionality and flexibility with a rich feature set. This advanced IC is designed to meet the demanding requirements of a wide range of applications, from complex digital processing to high-speed networking. Its 676-pin fine-pitch ball grid array (FBGA) packaging ensures a compact footprint while providing a robust 487 I/O interface for comprehensive connectivity options, making the FPGAs AMD Xilinx XC3S1500-5FGG676C a premier choice for developers and engineers seeking to innovate and scale their solutions.
XC3S1500-5FGG676C Features
This FPGA from AMD Xilinx stands out with its extensive capabilities that include high-density logic cells, advanced embedded memory, high-speed DSP blocks, and sophisticated clock management functions. These features enable the development of highly integrated, efficient, and scalable hardware platforms in a cost-effective and power-conscious manner, providing the agility required in modern electronic designs.
XC3S1500-5FGG676C Applications
- Data Processing: Utilizes its high logic density and DSP blocks for rapid data manipulation and processing in applications such as big data analytics and complex algorithms.
- Telecommunications: Employs its extensive I/O options and high-speed transceiver blocks for data transmission, signal processing, and infrastructure development in both wired and wireless communication systems.
- Consumer Electronics: Ideal for integration into consumer electronics where flexibility and re-programmability allow for extended product lifecycles with the ability to update functionalities via software.
- Automotive Systems: Suitable for automotive applications where robustness and reliability are essential, helping to manage and control various vehicular systems while adhering to stringent automotive standards.
- Industrial Automation: Enhances automation capabilities in industrial settings with its ability to handle complex control systems and real-time processing needs.
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