XC3S1500-5FG676C

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Mfr.Part #
XC3S1500-5FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 487 I/O 676FCBGA
Stock
1,555
In Stock :
1,555

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
0°C~85°C TJ
Number of Gates :
1500000
Number of Pins :
676
Total RAM Bits :
589824
Terminal Finish :
Tin/Lead (Sn63Pb37)
Supply Voltage :
1.2V
Published :
2008
Number of LABs/CLBs :
3328
RoHS Status :
Non-RoHS Compliant
Pbfree Code :
No
Series :
Spartan®-3
Factory Lead Time :
10 Weeks
Number of Logic Elements/Cells :
29952
Number of Outputs :
487
Width :
27mm
Length :
27mm
Terminal Position :
BOTTOM
Speed Grade :
5
Base Part Number :
XC3S1500
Reach Compliance Code :
not_compliant
ECCN Code :
3A991.D
Operating Supply Voltage :
1.2V
Terminal Pitch :
1mm
Package / Case :
676-BBGA, FCBGA
RAM Size :
72kB
Terminal Form :
Ball
Packaging :
Tray
Pin Count :
676
Qualification Status :
Not Qualified
Voltage - Supply :
1.14V~1.26V
Mounting Type :
Surface Mount
JESD-609 Code :
e0
Number of I/O :
487
Height Seated (Max) :
2.6mm
Time@Peak Reflow Temperature-Max (s) :
30
Mount :
Surface Mount
Number of Terminations :
676
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Peak Reflow Temperature (Cel) :
225
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Datasheets
XC3S1500-5FG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-5FG676C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Pins:676, Base Part Number:XC3S1500, Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, Number of Terminations:676, XC3S1500-5FG676C pinout, XC3S1500-5FG676C datasheet PDF, XC3S1500-5FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-5FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1500-5FG676C


FPGAs AMD Xilinx XC3S1500-5FG676C Overview

The AMD Xilinx XC3S1500-5FG676C is a state-of-the-art Field Programmable Gate Array (FPGA) designed for high-performance applications requiring flexible and rapid prototyping capabilities. This FPGA is part of the renowned Spartan-3 series, known for its cost-effectiveness and efficiency, making it ideal for a variety of commercial and industrial applications. The XC3S1500-5FG676C integrates seamlessly into systems, providing a robust platform for developers looking to exploit a wide range of functionalities. Equipped with 487 I/O ports and housed in a compact 676-pin FCBGA package, this FPGA offers excellent versatility and scalability, ensuring that it meets the needs of complex digital systems requiring high-speed data processing and significant logic integration.

XC3S1500-5FG676C Features

The XC3S1500-5FG676C from AMD Xilinx boasts an array of features that enhance its utility and performance in demanding applications. Key features include its 487 I/O pins which allow for extensive connectivity and interfacing capabilities, and its 676FCBGA packaging that ensures a compact footprint along with reliable mechanical and thermal stability. This FPGA also supports a variety of logic configurations, empowering designers with the flexibility to implement complex algorithms and logic circuits efficiently and effectively.

XC3S1500-5FG676C Applications

  • Communications Equipment: Utilized in routers, switches, and base station infrastructure, the XC3S1500-5FG676C helps manage and route high volumes of data efficiently, ensuring robust communication networks.
  • Industrial Automation: In automation systems, this FPGA can control machinery, process inputs from various sensors, and perform real-time decision making, increasing the efficiency and safety of industrial processes.
  • Consumer Electronics: Applied in devices like high-definition televisions and gaming consoles, the XC3S1500-5FG676C enhances processing capabilities, improving user interfaces and multimedia handling.
  • Automotive Systems: Supports advanced automotive applications such as driver assistance systems and infotainment, where reliability and rapid data processing are critical.
  • Medical Devices: Used in medical imaging systems like ultrasound and MRI machines, facilitating the processing of large data streams necessary for high-resolution imaging and diagnostics.
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