XC3S1500-4FGG320C

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Mfr.Part #
XC3S1500-4FGG320C
Manufacturer
AMD Xilinx
Package / Case
320-BGA
Datasheet
Download
Description
IC FPGA 221 I/O 320FBGA
Stock
443
In Stock :
443

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
RAM Size :
72kB
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
260
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Factory Lead Time :
10 Weeks
Power Supplies :
1.21.2/3.32.5V
Package / Case :
320-BGA
Number of Gates :
1500000
Number of Pins :
320
Voltage - Supply :
1.14V~1.26V
Packaging :
Tray
Speed Grade :
4
Number of Outputs :
221
Pbfree Code :
yes
Pin Count :
320
Total RAM Bits :
589824
Base Part Number :
XC3S1500
Width :
19mm
Mount :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.61 ns
Operating Temperature :
0°C~85°C TJ
Time@Peak Reflow Temperature-Max (s) :
30
ECCN Code :
3A991.D
Number of Terminations :
320
JESD-609 Code :
e1
RoHS Status :
ROHS3 Compliant
Terminal Pitch :
1mm
Length :
19mm
Operating Supply Voltage :
1.2V
Qualification Status :
Not Qualified
Terminal Form :
Ball
Number of LABs/CLBs :
3328
Number of Logic Elements/Cells :
29952
Supply Voltage :
1.2V
Height Seated (Max) :
2mm
Published :
2008
Series :
Spartan®-3
Mounting Type :
Surface Mount
Number of I/O :
221
Clock Frequency :
630MHz
Datasheets
XC3S1500-4FGG320C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-4FGG320C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:320-BGA, Number of Pins:320, Base Part Number:XC3S1500, Operating Temperature:0°C~85°C TJ, Number of Terminations:320, Mounting Type:Surface Mount, XC3S1500-4FGG320C pinout, XC3S1500-4FGG320C datasheet PDF, XC3S1500-4FGG320C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-4FGG320C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1500-4FGG320C


FPGAs AMD Xilinx XC3S1500-4FGG320C Overview

The FPGAs AMD Xilinx XC3S1500-4FGG320C is a highly versatile and powerful field-programmable gate array designed for advanced electronic systems requiring high levels of logic integration and flexibility. This device, manufactured by AMD Xilinx, integrates a rich feature set into a compact 320FBGA package, enabling designers to achieve more with less space. Ideal for a wide range of applications, this FPGA is engineered to meet the rigorous demands of modern digital circuits, offering a robust solution for developers looking to push the boundaries of technology.

XC3S1500-4FGG320C Features

The XC3S1500-4FGG320C boasts an array of impressive features including 221 I/O pins that provide ample flexibility for interfacing with a wide range of peripherals and devices. The 320FBGA package is optimized for a reduced footprint on the PCB while allowing for efficient thermal management. With its high integration capability, this FPGA facilitates complex system designs within a single chip, which is crucial for achieving high performance in tightly constrained spaces.

XC3S1500-4FGG320C Applications

  • Telecommunications: This FPGA can be used to manage signal processing and data flow in network equipment, improving bandwidth and reducing latency in systems like routers and switches.
  • Automotive Systems: In automotive applications, the XC3S1500-4FGG320C supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors to enhance vehicle safety and functionality.
  • Consumer Electronics: Applied in consumer electronics such as smart TVs and gaming consoles, this FPGA enhances processing capabilities, supporting richer user interfaces and more responsive gaming experiences.
  • Industrial Automation: It is instrumental in automating complex processes in manufacturing lines, where precise control and reliability are paramount to productivity and safety.
  • Aerospace and Defense: The FPGA’s ability to handle multiple operations in parallel and its resistance to environmental challenges make it ideal for aerospace applications, where reliability under extreme conditions is crucial.
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