XC3S1500-4FG676I

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Mfr.Part #
XC3S1500-4FG676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 487 I/O 676FCBGA
Stock
1,508
In Stock :
1,508

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Peak Reflow Temperature (Cel) :
225
JESD-609 Code :
e0
Width :
27mm
Clock Frequency :
630MHz
Package / Case :
676-BBGA, FCBGA
Supply Voltage :
1.2V
Operating Temperature :
-40°C~100°C TJ
Pin Count :
676
Terminal Position :
BOTTOM
Terminal Form :
Ball
Qualification Status :
Not Qualified
RoHS Status :
Non-RoHS Compliant
Number of Pins :
676
Series :
Spartan®-3
Number of Outputs :
487
Pbfree Code :
No
Length :
27mm
Time@Peak Reflow Temperature-Max (s) :
30
Base Part Number :
XC3S1500
Number of Gates :
1500000
Terminal Pitch :
1mm
Published :
2005
Height Seated (Max) :
2.6mm
Number of I/O :
487
Factory Lead Time :
10 Weeks
Mount :
Surface Mount
Number of Logic Elements/Cells :
29952
RAM Size :
72kB
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Power Supplies :
1.21.2/3.32.5V
Packaging :
Tray
ECCN Code :
3A991.D
Total RAM Bits :
589824
Speed Grade :
4
Number of Terminations :
676
Operating Supply Voltage :
1.2V
Combinatorial Delay of a CLB-Max :
0.61 ns
Number of LABs/CLBs :
3328
Voltage - Supply :
1.14V~1.26V
Terminal Finish :
Tin/Lead (Sn63Pb37)
Datasheets
XC3S1500-4FG676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-4FG676I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Number of Pins:676, Base Part Number:XC3S1500, Mounting Type:Surface Mount, Number of Terminations:676, XC3S1500-4FG676I pinout, XC3S1500-4FG676I datasheet PDF, XC3S1500-4FG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-4FG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1500-4FG676I


FPGAs AMD Xilinx XC3S1500-4FG676I Overview

Introducing the AMD Xilinx XC3S1500-4FG676I, a high-performance Field Programmable Gate Array (FPGA) that combines versatility with robust functionality, tailored for advanced digital processing needs. This IC FPGA, packaged in a compact 676-pin FCBGA (Flip Chip Ball Grid Array), offers a flexible solution for designers looking to leverage speed and integration. The XC3S1500-4FG676I is engineered to handle complex algorithms and multitasking environments, making it a key component in the development of cutting-edge technology and devices. Its ability to be programmed and re-programmed post-manufacture adds immense value, enabling custom configuration for specific applications and iterative updates in commercial and industrial settings.

XC3S1500-4FG676I Features

The XC3S1500-4FG676I from AMD Xilinx features 487 programmable I/O pins, providing vast options for interfacing and connectivity. The FPGA's robust architecture supports a wide array of logic operations and configurations, making it an ideal choice for projects requiring high-speed data processing and precise control. Additionally, its high pin count and adaptable nature ensure compatibility with multiple peripherals and systems, enhancing both its flexibility and scalability in complex electronic designs.

XC3S1500-4FG676I Applications

  • Telecommunications Infrastructure: Utilized in routers, switches, and network bridges to enhance signal integrity and data flow management, optimizing communication networks.
  • Aerospace and Defense Systems: Employs in navigation systems and onboard computers, providing reliable processing capabilities essential for mission-critical applications.
  • Automotive Electronics: Integrated into driver assistance systems to process real-time data from sensors, improving vehicle safety and performance.
  • Industrial Automation: Applied in machine control units for automating complex tasks, enhancing efficiency and precision in manufacturing processes.
  • Consumer Electronics: Powers high-definition multimedia interfaces and virtual reality systems, delivering superior user experiences through enhanced graphical processing.
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