XC3S1500-4FG456I

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Mfr.Part #
XC3S1500-4FG456I
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 333 I/O 456FBGA
Stock
141
In Stock :
141

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Height Seated (Max) :
2.6mm
Terminal Position :
BOTTOM
Published :
2008
Clock Frequency :
630MHz
Number of I/O :
333
Length :
23mm
Package / Case :
456-BBGA
Packaging :
Tray
Qualification Status :
Not Qualified
Series :
Spartan®-3
RAM Size :
72kB
Terminal Pitch :
1mm
Number of Gates :
1500000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
ECCN Code :
3A991.D
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Terminations :
456
Number of LABs/CLBs :
3328
Pbfree Code :
No
Mount :
Surface Mount
Factory Lead Time :
10 Weeks
Number of Logic Elements/Cells :
29952
Combinatorial Delay of a CLB-Max :
0.61 ns
Operating Supply Voltage :
1.2V
RoHS Status :
Non-RoHS Compliant
Peak Reflow Temperature (Cel) :
225
Speed Grade :
4
Number of Pins :
456
Pin Count :
456
JESD-609 Code :
e0
Base Part Number :
XC3S1500
Supply Voltage :
1.2V
Terminal Form :
Ball
Voltage - Supply :
1.14V~1.26V
Power Supplies :
1.21.2/3.32.5V
Time@Peak Reflow Temperature-Max (s) :
30
Operating Temperature :
-40°C~100°C TJ
Total RAM Bits :
589824
Terminal Finish :
Tin/Lead (Sn63Pb37)
Mounting Type :
Surface Mount
Number of Outputs :
333
Width :
23mm
Datasheets
XC3S1500-4FG456I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-4FG456I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:456-BBGA, Number of Terminations:456, Number of Pins:456, Base Part Number:XC3S1500, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, XC3S1500-4FG456I pinout, XC3S1500-4FG456I datasheet PDF, XC3S1500-4FG456I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1500-4FG456I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1500-4FG456I


FPGAs AMD Xilinx XC3S1500-4FG456I Overview

The AMD Xilinx XC3S1500-4FG456I FPGA is a highly flexible and powerful integrated circuit designed for demanding applications that require rapid prototyping and scalable hardware configurations. This FPGA device, part of the renowned Spartan-3 series, offers a robust solution with a 456-pin FBGA package, enabling efficient space utilization and superior performance in embedded processing tasks. The XC3S1500-4FG456I is an ideal choice for designers looking to leverage a high I/O count and extensive logic resources to achieve complex digital computations and real-time processing capabilities in their systems.

XC3S1500-4FG456I Features

  • Integrated circuit from FPGA category, featuring a 333 I/O count for versatile connectivity.
  • Encased in a compact 456-FBGA (Fine Pitch Ball Grid Array) package, ensuring a minimized footprint on system boards.
  • Optimized for low power consumption while maintaining high performance, making it suitable for power-sensitive applications.
  • Supports a wide range of design implementations due to its reprogrammable logic gates, allowing for repeated iterations and updates in system design.
  • Manufactured by AMD Xilinx, a leader in FPGA technology, assuring reliability and cutting-edge performance.

XC3S1500-4FG456I Applications

  • Telecommunications Infrastructure: Utilized in routers and switches to manage data flow efficiently, ensuring high-speed data processing and improved network reliability.
  • Automotive Systems: Critical in the development of automotive safety and control systems, such as advanced driver-assistance systems (ADAS), enhancing vehicle response and driver safety.
  • Consumer Electronics: Forms the core of many consumer electronic devices, enabling sophisticated user interfaces and high-performance multimedia handling in products such as smart TVs and gaming consoles.
  • Industrial Automation: Applied in control systems for industrial automation, improving operational efficiency and precision in processes like robotic assembly and process control.
  • Medical Devices: Integral to medical imaging systems, where it processes complex algorithms rapidly to deliver precise and real-time imaging required in diagnostics.
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