XC3S1400A-4FTG256C
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- Mfr.Part #
- XC3S1400A-4FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 161 I/O 256FTBGA
- Stock
- 29,541
- In Stock ：
- 29,541
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- REACH SVHC :
- No SVHC
- Series :
- Spartan®-3A
- Number of Outputs :
- 148
- Peak Reflow Temperature (Cel) :
- 260
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Mounting Type :
- Surface Mount
- RAM Size :
- 72kB
- Number of LABs/CLBs :
- 2816
- Number of Pins :
- 256
- Package / Case :
- 256-LBGA
- Length :
- 17mm
- Number of Gates :
- 1400000
- Terminal Position :
- BOTTOM
- Frequency :
- 250MHz
- Termination :
- SMD/SMT
- Base Part Number :
- XC3S1400A
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Supply Voltage :
- 1.2V
- Operating Temperature :
- 0°C~85°C TJ
- ECCN Code :
- EAR99
- Width :
- 17mm
- JESD-609 Code :
- e1
- Factory Lead Time :
- 10 Weeks
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 1.14V~1.26V
- Number of Terminations :
- 256
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 1.2V
- Number of I/O :
- 161
- Qualification Status :
- Not Qualified
- Pin Count :
- 256
- Speed Grade :
- 4
- Mount :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Power Supplies :
- 1.21.2/3.33.3V
- Number of Logic Elements/Cells :
- 25344
- Published :
- 2007
- Total RAM Bits :
- 589824
- Height Seated (Max) :
- 1.55mm
- Terminal Form :
- Ball
- Datasheets
- XC3S1400A-4FTG256C
FPGAs AMD Xilinx XC3S1400A-4FTG256C Overview
The AMD Xilinx XC3S1400A-4FTG256C FPGA stands out in the market for its robust feature set tailored for versatile applications that demand high-performance, programmability, and efficient power consumption. This component is part of the Spartan-3A series, known for delivering cost-effective solutions without compromising on quality and efficiency. The XC3S1400A-4FTG256C, housed in a compact 256FTBGA package, offers an exceptional balance of programmable logic density, signal processing capabilities, and interface options, making it a go-to FPGA for a wide range of industrial applications. Its integration capabilities are suited for developers looking for customizable solutions in complex electronic environments.
XC3S1400A-4FTG256C Features
This FPGA is designed with 161 I/O pins, allowing ample connections for various peripherals and systems. The 256FTBGA packaging ensures a minimal footprint on system boards, which is crucial for applications requiring dense configurations in limited spaces. The XC3S1400A-4FTG256C supports a wide range of digital and analog functionalities, which can be programmed and re-programmed to meet specific needs, thereby enhancing system adaptability and future-proofing investments.
XC3S1400A-4FTG256C Applications
- Consumer Electronics: Utilized in devices such as digital cameras and gaming consoles, where the FPGA's ability to handle multiple input/output configurations and high-speed signal processing enhances multimedia functionalities.
- Telecommunications: Deployed in communication infrastructure equipment like routers and switches, enabling efficient data flow management and signal integrity across complex networks.
- Automotive Applications: Integrated into automotive safety systems, providing reliable and flexible solutions for advanced driver-assistance systems (ADAS) which require real-time processing capabilities.
- Industrial Automation: Used in control systems for factories and plants, where the FPGA's robustness and adaptability optimize operational efficiencies and support advanced robotic functionalities.
- Medical Equipment: Key component in medical imaging systems such as ultrasound and MRI machines, enabling precise control and rapid processing of complex imaging data.
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