XC3S1400A-4FGG676I

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Mfr.Part #
XC3S1400A-4FGG676I
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 502 I/O 676FBGA
Stock
1,771
In Stock :
1,771

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Gates :
1400000
ECCN Code :
3A991.D
Terminal Pitch :
1mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Base Part Number :
XC3S1400A
Mount :
Surface Mount
Terminal Form :
Ball
Operating Temperature :
-40°C~100°C TJ
Speed Grade :
4
Clock Frequency :
667MHz
Number of Logic Elements/Cells :
25344
Number of Terminations :
676
Combinatorial Delay of a CLB-Max :
0.71 ns
Number of I/O :
502
RoHS Status :
ROHS3 Compliant
Packaging :
Tray
Factory Lead Time :
10 Weeks
Published :
2007
Pin Count :
676
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-609 Code :
e1
Number of Outputs :
408
Voltage - Supply :
1.14V~1.26V
Width :
27mm
Peak Reflow Temperature (Cel) :
250
Mounting Type :
Surface Mount
Series :
Spartan®-3A
Qualification Status :
Not Qualified
Number of Pins :
676
Total RAM Bits :
589824
RAM Size :
72kB
Power Supplies :
1.22.5/3.3V
Pbfree Code :
yes
Supply Voltage :
1.2V
Package / Case :
676-BGA
Terminal Position :
BOTTOM
Number of LABs/CLBs :
2816
REACH SVHC :
Unknown
Operating Supply Voltage :
1.2V
Length :
27mm
Time@Peak Reflow Temperature-Max (s) :
30
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1400A-4FGG676I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC3S1400A, Operating Temperature:-40°C~100°C TJ, Number of Terminations:676, Mounting Type:Surface Mount, Number of Pins:676, Package / Case:676-BGA, XC3S1400A-4FGG676I pinout, XC3S1400A-4FGG676I datasheet PDF, XC3S1400A-4FGG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1400A-4FGG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1400A-4FGG676I


FPGAs AMD Xilinx XC3S1400A-4FGG676I Overview

The FPGAs AMD Xilinx XC3S1400A-4FGG676I is a highly capable integrated circuit designed for applications requiring high-speed, flexible logic solutions. Manufactured by the renowned AMD Xilinx, this FPGA is housed in a 676FBGA package and boasts an impressive array of 502 I/O pins, making it highly adaptable for complex digital environments. This product is engineered to support a wide range of applications, offering designers the flexibility to implement configurations tailored to their specific needs, all while maintaining a robust and reliable operation. The XC3S1400A-4FGG676I excels in delivering high-performance computing power necessary for intensive processing tasks, ensuring efficient and effective execution of applications.

XC3S1400A-4FGG676I Features

This FPGA features a robust architecture that can handle multiple inputs and outputs with ease, supporting a wide variety of digital and analog functionalities. Its large number of I/O pins allows for extensive connectivity options, which is crucial for systems requiring numerous simultaneous connections without sacrificing performance. The chip is also designed for enhanced thermal management, making it ideal for use in environments where reliability is as crucial as performance. Enhanced security features ensure that sensitive data handled by the FPGA remains protected against potential threats, thus making it a trusted choice for critical applications.

XC3S1400A-4FGG676I Applications

  • Telecommunications: Utilized in communications infrastructure to manage signal processing and data flow efficiently, enhancing network reliability and speed.
  • Automotive Systems: Employed in advanced driver-assistance systems (ADAS) to process real-time data from sensors and cameras, aiding in decision-making and vehicle automation.
  • Industrial Automation: Key component in control systems, helping to regulate and monitor industrial processes with high precision and reliability.
  • Consumer Electronics: Integrated into devices such as high-definition televisions and gaming consoles, where it processes complex video and audio data to deliver enhanced user experiences.
  • Medical Devices: Critical in the operation of diagnostic and imaging equipment, ensuring accurate data handling and real-time processing capabilities.
This HTML segment efficiently outlines the capabilities, features, and potential applications of the XC3S1400A-4FGG676I FPGA, providing a comprehensive understanding suitable for B2B clients considering high-volume purchases.
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