XC3S1400A-4FG676I
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- Mfr.Part #
- XC3S1400A-4FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 502 I/O 676FCBGA
- Stock
- 39,711
- In Stock ：
- 39,711
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Mounting Type :
- Surface Mount
- JESD-609 Code :
- e0
- Number of LABs/CLBs :
- 2816
- Power Supplies :
- 1.22.5/3.3V
- Width :
- 27mm
- Terminal Form :
- Ball
- Length :
- 27mm
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Factory Lead Time :
- 10 Weeks
- Voltage - Supply :
- 1.14V~1.26V
- Published :
- 2007
- Number of Gates :
- 1400000
- Number of Terminations :
- 676
- Total RAM Bits :
- 589824
- Package / Case :
- 676-BBGA, FCBGA
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 667MHz
- Speed Grade :
- 4
- Packaging :
- Tray
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Operating Supply Voltage :
- 1.2V
- Pin Count :
- 676
- Mount :
- Surface Mount
- Operating Temperature :
- -40°C~100°C TJ
- ECCN Code :
- 3A991.D
- Series :
- Spartan®-3A
- RAM Size :
- 72kB
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- 225
- Supply Voltage :
- 1.2V
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Number of Pins :
- 676
- Pbfree Code :
- No
- Number of Logic Elements/Cells :
- 25344
- Number of I/O :
- 502
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 408
- Base Part Number :
- XC3S1400A
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- XC3S1400A-4FG676I
FPGAs AMD Xilinx XC3S1400A-4FG676I Overview
The FPGAs AMD Xilinx XC3S1400A-4FG676I is a high-performance, field-programmable gate array designed to meet the demands of complex digital circuits. With its extensive I/O capabilities, housed in a compact 676-pin flip-chip ball grid array (FCBGA) package, this FPGA offers a versatile solution for a wide range of technological applications. AMD Xilinx's reputation for reliability and innovation is embodied in the XC3S1400A-4FG676I, making it an ideal choice for developers looking to push the boundaries of hardware acceleration, signal processing, and system integration.
XC3S1400A-4FG676I Features
The XC3S1400A-4FG676I FPGA from AMD Xilinx boasts a robust set of features suitable for high-demand applications. Key attributes include its 502 user I/Os, allowing for versatile connectivity options. The chip is engineered using advanced technology that supports a variety of logic implementations and configurability, ensuring adaptability to specific project requirements. Its thermal and power efficiency metrics are optimized for sustained performance, essential for continuous operation in critical systems.
XC3S1400A-4FG676I Applications
- Telecommunications Infrastructure: Used in the design and deployment of telecommunications hardware such as routers and switches, where high-speed signal processing is crucial.
- Automotive Electronics: Can be integrated into automotive safety and control systems, providing the computational power needed for advanced driver-assistance systems (ADAS).
- Industrial Automation: Ideal for use in automated manufacturing processes, where precise control and flexibility are required to manage complex operations.
- Consumer Electronics: Forms the backbone of many consumer electronics, including smart home devices and entertainment systems, where efficient processing and connectivity are key.
- Aerospace and Defense: Critical in the development of aerospace systems, such as navigation and control instruments, where reliability and high-level computation capabilities are mandatory.
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