XC3S1200E-5FTG256C
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- Mfr.Part #
- XC3S1200E-5FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 190 I/O 256FTBGA
- Stock
- 45
- In Stock ：
- 45
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Factory Lead Time :
- 10 Weeks
- Mount :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 2168
- Number of I/O :
- 190
- Terminal Position :
- BOTTOM
- Number of Gates :
- 1200000
- Series :
- Spartan®-3E
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Pitch :
- 1mm
- Supply Voltage :
- 1.2V
- Number of Registers :
- 17344
- Number of Terminations :
- 256
- Package / Case :
- 256-LBGA
- Total RAM Bits :
- 516096
- RAM Size :
- 63kB
- RoHS Status :
- ROHS3 Compliant
- Length :
- 17mm
- Voltage - Supply :
- 1.14V~1.26V
- Published :
- 2009
- Combinatorial Delay of a CLB-Max :
- 0.66 ns
- Operating Supply Voltage :
- 1.2V
- Pin Count :
- 256
- Pbfree Code :
- yes
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Number of Pins :
- 256
- Width :
- 17mm
- Number of Outputs :
- 150
- Qualification Status :
- Not Qualified
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 19512
- Terminal Finish :
- TIN SILVER COPPER
- Terminal Form :
- Ball
- Speed Grade :
- 5
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- EAR99
- Operating Temperature :
- 0°C~85°C TJ
- Base Part Number :
- XC3S1200E
- Datasheets
- XC3S1200E-5FTG256C
FPGAs AMD Xilinx XC3S1200E-5FTG256C Overview
The FPGAs AMD Xilinx XC3S1200E-5FTG256C is a high-performance, field-programmable gate array designed for advanced integrated circuit applications. Engineered by AMD Xilinx, a leader in digital technology, this FPGA offers a versatile platform for developing and deploying a wide range of electronic systems. With its 256FTBGA package, it provides a robust solution for designers looking to leverage a dense, programmable logic device with reduced footprint. This model is particularly noted for its ability to support complex digital computations and its adaptability to multiple uses in commercial and industrial environments.
XC3S1200E-5FTG256C Features
This particular model of FPGA offers 190 I/O pins, which allows for extensive interfacing with other peripherals and systems, enhancing its utility in complex digital environments. The 256FTBGA packaging ensures a compact design that fits more technology into smaller spaces, crucial for modern electronic devices. The XC3S1200E-5FTG256C is optimized for performance with a configuration that supports high-speed digital processing, making it ideal for both prototyping and full-scale deployment.
XC3S1200E-5FTG256C Applications
- Consumer Electronics: Applied in devices such as smartphones, tablets, and other personal electronics, the XC3S1200E-5FTG256C facilitates rapid data processing and enhances multifunctional capabilities.
- Automotive Systems: Utilized in advanced driver-assistance systems (ADAS), this FPGA improves vehicle responsiveness through fast computation and reliable operation under various conditions.
- Industrial Automation: In robotic systems, the XC3S1200E-5FTG256C drives complex machinery with precise control and adaptability, contributing to more efficient manufacturing processes.
- Data Centers: Essential for data storage systems, it helps in managing large data flows and supports high-speed data processing tasks essential for cloud computing.
- Telecommunications Infrastructure: Plays a critical role in network devices, including routers and switches, ensuring efficient data transmission and high throughput capabilities.
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