XC3S1200E-4FTG256C
- Mfr.Part #
- XC3S1200E-4FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 190 I/O 256FTBGA
- Stock
- 8,546
- In Stock :
- 8,546
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Length :
- 17mm
- RoHS Status :
- ROHS3 Compliant
- Base Part Number :
- XC3S1200E
- Operating Temperature :
- 0°C~85°C TJ
- Number of Outputs :
- 150
- Clock Frequency :
- 572MHz
- RAM Size :
- 63kB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 1.14V~1.26V
- Operating Supply Voltage :
- 1.2V
- Number of Terminations :
- 256
- Mounting Type :
- Surface Mount
- Number of I/O :
- 190
- Width :
- 17mm
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Package / Case :
- 256-LBGA
- Series :
- Spartan®-3E
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 516096
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Speed Grade :
- 4
- Number of Registers :
- 17344
- Supply Voltage :
- 1.2V
- ECCN Code :
- EAR99
- Height Seated (Max) :
- 1.55mm
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 256
- Factory Lead Time :
- 10 Weeks
- Pbfree Code :
- yes
- Terminal Position :
- BOTTOM
- Power Supplies :
- 1.21.2/3.32.5V
- Terminal Pitch :
- 1mm
- Number of Logic Elements/Cells :
- 19512
- Peak Reflow Temperature (Cel) :
- 260
- Number of Gates :
- 1200000
- Mount :
- Surface Mount
- Published :
- 2008
- Number of Pins :
- 256
- Number of LABs/CLBs :
- 2168
- Datasheets
- XC3S1200E-4FTG256C

FPGAs AMD Xilinx XC3S1200E-4FTG256C Overview
The FPGAs AMD Xilinx XC3S1200E-4FTG256C is a high-performance, field-programmable gate array that offers a robust platform for complex digital circuit development and deployment. Designed by AMD Xilinx, a leader in integrated circuits technology, this FPGA features a dense array of programmable logic cells and an extensive set of I/O capabilities, housed within a 256FTBGA package. The versatility of the XC3S1200E-4FTG256C makes it ideal for a wide range of applications, from industrial to communication systems, where flexibility and re-programmability are key. Utilizing this cutting-edge technology enables developers to achieve faster time-to-market with reliable performance that meets the demanding requirements of modern electronic environments.
XC3S1200E-4FTG256C Features
The XC3S1200E-4FTG256C FPGA by AMD Xilinx boasts several key features making it highly desirable for various applications. It includes 190 programmable I/O ports that provide ample connectivity for multiple peripherals and interfaces. The chip is based on a 4th generation architecture, ensuring optimized power efficiency and enhanced processing capabilities. Additionally, its compatibility with standard design tools enhances ease of use and accessibility for engineers and designers alike.
XC3S1200E-4FTG256C Applications
- Telecommunications: Utilized in signal processing equipment for data transmission and reception, enhancing bandwidth and reducing latency.
- Consumer Electronics: Integral in developing interactive and multimedia features for smart TVs and gaming consoles, where flexibility and high processing ability are crucial.
- Automotive: Used in driver assistance systems to process multiple inputs simultaneously, improving vehicle safety and functionality.
- Industrial Automation: Empowers complex robotic systems and factory automation projects, providing adaptable control and monitoring solutions.
- Medical Devices: Essential for high-speed medical imaging systems, enabling real-time processing and analysis of complex data sets.
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