XC3S1200E-4FT256I

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Mfr.Part #
XC3S1200E-4FT256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 190 I/O 256FTBGA
Stock
1,288
In Stock :
1,288

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Pins :
256
Mount :
Surface Mount
Combinatorial Delay of a CLB-Max :
0.76 ns
Number of Terminations :
256
Length :
17mm
Voltage - Supply :
1.14V~1.26V
Speed Grade :
4
Supply Voltage :
1.2V
Number of Registers :
17344
Terminal Finish :
Tin/Lead (Sn63Pb37)
Width :
17mm
Pbfree Code :
No
Operating Temperature :
-40°C~100°C TJ
Time@Peak Reflow Temperature-Max (s) :
30
RoHS Status :
Non-RoHS Compliant
Number of Gates :
1200000
Number of Outputs :
150
Qualification Status :
Not Qualified
Terminal Form :
Ball
Terminal Position :
BOTTOM
JESD-609 Code :
e0
Total RAM Bits :
516096
Clock Frequency :
572MHz
Number of LABs/CLBs :
2168
Height Seated (Max) :
1.55mm
Mounting Type :
Surface Mount
Series :
Spartan®-3E
Base Part Number :
XC3S1200E
Terminal Pitch :
1mm
Peak Reflow Temperature (Cel) :
240
Package / Case :
256-LBGA
Factory Lead Time :
10 Weeks
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
19512
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Power Supplies :
1.21.2/3.32.5V
Published :
2009
Number of I/O :
190
Packaging :
Tray
Operating Supply Voltage :
1.2V
RAM Size :
63kB
Datasheets
XC3S1200E-4FT256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1200E-4FT256I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:256, Number of Terminations:256, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Base Part Number:XC3S1200E, Package / Case:256-LBGA, XC3S1200E-4FT256I pinout, XC3S1200E-4FT256I datasheet PDF, XC3S1200E-4FT256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1200E-4FT256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1200E-4FT256I


FPGAs AMD Xilinx XC3S1200E-4FT256I Overview

Introducing the AMD Xilinx XC3S1200E-4FT256I, a robust Field Programmable Gate Array (FPGA) designed to deliver exceptional performance and flexibility. This device is tailored for engineers and designers who require a high-grade programmable logic solution that supports a wide range of applications. With a compact form factor in a 256FTBGA package, it offers a perfect balance between I/O capabilities and size, making it an ideal choice for space-constrained applications. The XC3S1200E-4FT256I is built to handle complex digital processing tasks with ease, ensuring efficient operation and reliability for critical projects.

XC3S1200E-4FT256I Features

The XC3S1200E-4FT256I FPGA is equipped with 190 I/O pins, allowing for extensive peripheral and module connections. This device operates effectively within a temperature range of -40°C to 100°C, making it suitable for use in harsh environments. Its 256FTBGA package ensures a minimal footprint on system boards, thus optimizing board space. Moreover, the FPGA offers robust security and protection features, ensuring safe and secure data handling and processing.

XC3S1200E-4FT256I Applications

  • Telecommunications: Utilized in communication equipment for signal processing and data transport enhancements.
  • Automotive Systems: Deployed in automotive electronics for control systems and driver assistance features.
  • Industrial Automation: Enhances productivity and efficiency in robotics and process control systems.
  • Consumer Electronics: Integral to devices requiring complex user interfaces and multimedia processing.
  • Aerospace and Defense: Critical for navigation, control systems, and other sensitive applications requiring high reliability and extended temperature support.
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