XC3S1200E-4FGG320C
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- Mfr.Part #
- XC3S1200E-4FGG320C
- Manufacturer
- AMD Xilinx
- Package / Case
- 320-BGA
- Datasheet
- Download
- Description
- IC FPGA 250 I/O 320FBGA
- Stock
- 366
- In Stock ：
- 366
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mount :
- Surface Mount
- Series :
- Spartan®-3E
- Total RAM Bits :
- 516096
- Supply Voltage :
- 1.2V
- Number of I/O :
- 250
- Operating Temperature :
- 0°C~85°C TJ
- Number of LABs/CLBs :
- 2168
- Published :
- 2009
- Qualification Status :
- Not Qualified
- Number of Gates :
- 1200000
- Voltage - Supply :
- 1.14V~1.26V
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 2mm
- RAM Size :
- 63kB
- Width :
- 19mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Outputs :
- 194
- Terminal Form :
- Ball
- Power Supplies :
- 1.21.2/3.32.5V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 260
- Clock Frequency :
- 572MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Factory Lead Time :
- 10 Weeks
- Operating Supply Voltage :
- 1.2V
- Number of Registers :
- 17344
- Terminal Pitch :
- 1mm
- Number of Logic Elements/Cells :
- 19512
- Lead Free :
- Lead Free
- Pin Count :
- 320
- Terminal Position :
- BOTTOM
- Package / Case :
- 320-BGA
- Pbfree Code :
- yes
- Number of Pins :
- 320
- JESD-609 Code :
- e1
- Length :
- 19mm
- Speed Grade :
- 4
- ECCN Code :
- 3A991.D
- Number of Terminations :
- 320
- Base Part Number :
- XC3S1200E
- Datasheets
- XC3S1200E-4FGG320C
FPGAs AMD Xilinx XC3S1200E-4FGG320C Overview
The FPGAs AMD Xilinx XC3S1200E-4FGG320C is a highly versatile, field-programmable gate array designed to meet the demanding needs of modern digital circuits. Developed by AMD Xilinx, a leader in digital circuit technology, this FPGA offers a robust solution for designers looking to accelerate their product development with flexible, high-performance hardware. With its 250 I/O capabilities housed in a compact 320 FBGA package, this product is ideal for applications requiring dense, high-speed programmable logic in a small footprint. The XC3S1200E-4FGG320C provides a reliable platform for developing advanced digital applications, ensuring efficient performance and scalability.
XC3S1200E-4FGG320C Features
The XC3S1200E-4FGG320C FPGA includes numerous features that make it a top choice for developers and engineers. Key features include its 320-pin fine-pitch ball grid array (FBGA) package, which offers a compact solution without sacrificing connectivity. The device supports a wide range of digital signaling standards, providing flexibility in integrating various system components. Additionally, its high logic capacity allows for complex digital circuit designs, making it suitable for sophisticated applications that require dynamic reprogramming and high data throughput.
XC3S1200E-4FGG320C Applications
- Telecommunications Equipment: Used in routers, switches, and network interfaces where high-speed signal processing is critical for data flow management and signal integrity.
- Consumer Electronics: Integral in the development of consumer electronics such as digital cameras, gaming consoles, and high-definition televisions, where processing speed and graphical output need to meet high consumer expectations.
- Automotive Applications: Utilized in advanced driver-assistance systems (ADAS) and infotainment systems, enhancing both safety and user experience in modern vehicles.
- Industrial Automation: Plays a crucial role in the control systems of automated production lines, improving operational efficiency and precision in complex industrial environments.
- Medical Devices: Key in the design of medical imaging systems, such as ultrasound and MRI machines, where precise and rapid processing of large datasets is essential for accurate diagnostics.
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