XC3S1200E-4FG320C
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- Mfr.Part #
- XC3S1200E-4FG320C
- Manufacturer
- AMD Xilinx
- Package / Case
- 320-BGA
- Datasheet
- Download
- Description
- IC FPGA 250 I/O 320FBGA
- Stock
- 1
- In Stock ：
- 1
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Package / Case :
- 320-BGA
- Series :
- Spartan®-3E
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Qualification Status :
- Not Qualified
- Number of I/O :
- 250
- Number of Registers :
- 17344
- Pbfree Code :
- No
- Total RAM Bits :
- 516096
- Width :
- 19mm
- Operating Supply Voltage :
- 1.2V
- Number of Gates :
- 1200000
- Surface Mount :
- yes
- Length :
- 19mm
- RoHS Status :
- Non-RoHS Compliant
- Number of Logic Elements/Cells :
- 19512
- Packaging :
- Bulk
- JESD-609 Code :
- e0
- Supply Voltage :
- 1.2V
- Clock Frequency :
- 572MHz
- Factory Lead Time :
- 10 Weeks
- RAM Size :
- 63kB
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 1mm
- Speed Grade :
- 4
- Number of Outputs :
- 194
- Number of Terminations :
- 320
- Peak Reflow Temperature (Cel) :
- 225
- JESD-30 Code :
- S-PBGA-B320
- Power Supplies :
- 1.21.2/3.32.5V
- Number of LABs/CLBs :
- 2168
- ECCN Code :
- 3A991.D
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Published :
- 2008
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 2mm
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Terminal Form :
- Ball
- Voltage - Supply :
- 1.14V~1.26V
- Reach Compliance Code :
- not_compliant
- Number of Inputs :
- 250
- Pin Count :
- 320
- Datasheets
- XC3S1200E-4FG320C
FPGAs AMD Xilinx XC3S1200E-4FG320C Overview
The FPGAs AMD Xilinx XC3S1200E-4FG320C is a highly capable field-programmable gate array designed to meet the demanding needs of modern digital circuits. Engineered by AMD Xilinx, a leader in programmable logic solutions, this FPGA is optimized for versatility and performance. Featuring a substantial array of logic elements and a rich set of I/O options, the XC3S1200E-4FG320C excels in applications requiring high-speed data processing and high-density integration. Its 320-pin fine-pitch ball grid array (FBGA) packaging ensures a compact form factor, making it ideal for space-constrained applications while still providing ample connectivity for complex digital interactions.
XC3S1200E-4FG320C Features
The XC3S1200E-4FG320C FPGA boasts a robust suite of features that enhance its utility in a broad range of applications. Key features include a configuration of 250 I/O pins that support a variety of interface standards, enabling flexible design options. The device's high-speed DSP slices are perfect for advanced signal processing tasks. Additionally, its efficient power management capabilities ensure that the device performs optimally with minimal power consumption, crucial for energy-sensitive projects.
XC3S1200E-4FG320C Applications
- Telecommunications Equipment: Utilized in routers and switches, the XC3S1200E-4FG320C handles high-speed signal processing tasks, facilitating efficient data flow and network reliability.
- Automotive Systems: Employed in advanced driver-assistance systems (ADAS), this FPGA processes multiple inputs from sensors and cameras to enhance vehicle safety and performance.
- Consumer Electronics: Integral to smart home devices, where it manages inputs from various sensors and executes control commands, ensuring smooth and responsive user interactions.
- Industrial Automation: Crucial in control systems where precision and reliability are required, helping to manage and monitor automated production lines.
- Medical Devices: Applied in medical imaging systems, the XC3S1200E-4FG320C processes complex data from imaging devices, contributing to clearer and more accurate diagnostics.
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