XC3S1000L-4FTG256C

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Mfr.Part #
XC3S1000L-4FTG256C
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 173 I/O 256FTBGA
Stock
36,704
In Stock :
36,704

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
480
Packaging :
Tray
Terminal Position :
BOTTOM
Power Supplies :
1.21.2/3.32.5V
RoHS Status :
RoHS Compliant
Package / Case :
256-LBGA
Published :
1999
Surface Mount :
yes
Width :
17mm
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Pitch :
1mm
Base Part Number :
XC3S1000L
Number of Outputs :
173
Total RAM Bits :
442368
Terminal Form :
Ball
Number of CLBs :
1920
Operating Temperature :
0°C~85°C TJ
Series :
Spartan®-3L
HTS Code :
8542.39.00.01
Pin Count :
256
Number of Logic Elements/Cells :
17280
Number of I/O :
173
Qualification Status :
Not Qualified
Height Seated (Max) :
1.55mm
Number of Terminations :
256
Number of Gates :
1000000
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-30 Code :
S-PBGA-B256
Reach Compliance Code :
Unknown
Number of Inputs :
173
Mounting Type :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Supply Voltage :
1.2V
JESD-609 Code :
e1
Length :
17mm
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000L-4FTG256C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Base Part Number:XC3S1000L, Operating Temperature:0°C~85°C TJ, Number of Terminations:256, Mounting Type:Surface Mount, XC3S1000L-4FTG256C pinout, XC3S1000L-4FTG256C datasheet PDF, XC3S1000L-4FTG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000L-4FTG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1000L-4FTG256C


FPGAs AMD Xilinx XC3S1000L-4FTG256C Overview

The FPGAs AMD Xilinx XC3S1000L-4FTG256C is a high-performance, field-programmable gate array designed for advanced electronic applications that demand high-speed, reliable processing, and versatile I/O options. This component, manufactured by industry leader AMD Xilinx, offers a robust platform for developing sophisticated digital and mixed-signal circuits. Its capacity and capabilities make it ideal for designers aiming to rapidly prototype and implement their ideas in hardware, ensuring a swift transition from concept to market.

XC3S1000L-4FTG256C Features

This particular model of FPGA boasts 173 I/O ports housed in a compact 256FTBGA package, which allows for efficient space usage and simpler board layout. The XC3S1000L-4FTG256C supports a wide range of digital signaling, providing ample flexibility in connecting to both legacy and cutting-edge systems. With its advanced security features, this FPGA ensures safe and secure operation, critical in today's technology environment where data integrity and system reliability are paramount.

XC3S1000L-4FTG256C Applications

  • Consumer Electronics: Utilized in devices like smartphones and tablets to manage signal processing functions efficiently and improve user interface responsiveness.
  • Automotive Systems: Employs advanced control systems for applications such as in-vehicle infotainment, driver assistance systems, and sophisticated engine management systems.
  • Industrial Automation: Applied in controlling machinery, monitoring system performance, and optimizing operational parameters, which is crucial for improving manufacturing efficiency and reliability.
  • Telecommunication Infrastructure: Helps in processing signals for communications equipment, including routers and switches, enhancing data throughput and network reliability.
  • Aerospace and Defense: Used in mission-critical applications, from navigation systems to complex avionics, where robustness and reliability are essential.
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