XC3S1000L-4FGG676C

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Mfr.Part #
XC3S1000L-4FGG676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 391 I/O 676FBGA
Stock
11,522
In Stock :
11,522

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
Spartan®-3L
Number of I/O :
391
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of LABs/CLBs :
480
Published :
1999
Supplier Device Package :
676-FBGA (27x27)
Number of Gates :
1000000
Base Part Number :
XC3S1000L
Number of Logic Blocks (LABs) :
480
Max Operating Temperature :
85°C
Voltage - Supply :
1.14V~1.26V
RoHS Status :
RoHS Compliant
Package / Case :
676-BGA
Number of Logic Elements/Cells :
17280
Mounting Type :
Surface Mount
Total RAM Bits :
442368
Packaging :
Tray
RAM Size :
54kB
Operating Temperature :
0°C~85°C TJ
Min Operating Temperature :
0°C
Mount :
Surface Mount
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000L-4FGG676C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC3S1000L, Package / Case:676-BGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, XC3S1000L-4FGG676C pinout, XC3S1000L-4FGG676C datasheet PDF, XC3S1000L-4FGG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000L-4FGG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1000L-4FGG676C


FPGAs AMD Xilinx XC3S1000L-4FGG676C Overview

The FPGAs AMD Xilinx XC3S1000L-4FGG676C is a highly capable FPGA (Field Programmable Gate Array) designed to meet the versatile needs of modern digital applications. Engineered by AMD Xilinx, a leader in digital design and integration, this device offers a powerful solution for developers looking to harness the flexibility of programmable logic combined with high-speed performance. The XC3S1000L-4FGG676C is specifically built to support complex algorithms and processes, making it an ideal choice for industries looking to innovate and improve their technological infrastructure.

XC3S1000L-4FGG676C Features

This FPGA features 391 I/O pins packaged neatly in a 676-pin FBGA (Fine-Pitch Ball Grid Array), offering ample flexibility for various digital and analog connections. Its architecture allows for scalable designs, which is crucial for applications requiring specific configurations and customization. The high pin count and versatile package support complex circuit designs and are suitable for intensive processing tasks.

XC3S1000L-4FGG676C Applications

  • Telecommunications Equipment: Utilized in routers and switches, enhancing signal integrity and processing speeds required for high-bandwidth communications.
  • Automotive Systems: Employs advanced driver-assistance systems (ADAS) to process real-time sensory data, ensuring higher safety and performance standards in vehicles.
  • Consumer Electronics: Integrated into smart home devices, providing the necessary processing power to handle multiple user inputs and connectivity options seamlessly.
  • Industrial Automation: Helps in managing control systems and complex machinery operations, increasing efficiency and reliability in production environments.
  • Medical Devices: Applied in diagnostic and monitoring equipment, capable of handling precise calculations and real-time data analysis to aid healthcare services.
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