XC3S1000L-4FGG456C

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Mfr.Part #
XC3S1000L-4FGG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 333 I/O 456FBGA
Stock
19,224
In Stock :
19,224

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Outputs :
333
Operating Temperature :
0°C~85°C TJ
Number of LABs/CLBs :
480
Terminal Form :
Ball
RAM Size :
54kB
Packaging :
Tray
Published :
1999
Voltage - Supply :
1.14V~1.26V
Number of I/O :
333
Number of Pins :
456
HTS Code :
8542.39.00.01
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Spartan®-3L
Qualification Status :
Not Qualified
Number of CLBs :
1920
Number of Gates :
1000000
Mount :
Surface Mount
Pin Count :
456
Supply Voltage :
1.2V
Height Seated (Max) :
2.6mm
Total RAM Bits :
442368
JESD-609 Code :
e1
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish :
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Width :
23mm
Number of Terminations :
456
Package / Case :
456-BBGA
Number of Logic Elements/Cells :
17280
Length :
23mm
Mounting Type :
Surface Mount
Base Part Number :
XC3S1000L
RoHS Status :
RoHS Compliant
Terminal Position :
BOTTOM
Power Supplies :
1.21.2/3.32.5V
Reach Compliance Code :
Unknown
Terminal Pitch :
1mm
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000L-4FGG456C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Pins:456, Number of Terminations:456, Package / Case:456-BBGA, Mounting Type:Surface Mount, Base Part Number:XC3S1000L, XC3S1000L-4FGG456C pinout, XC3S1000L-4FGG456C datasheet PDF, XC3S1000L-4FGG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000L-4FGG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1000L-4FGG456C


FPGAs AMD Xilinx XC3S1000L-4FGG456C Overview

The FPGAs AMD Xilinx XC3S1000L-4FGG456C is a high-performance, field-programmable gate array that delivers exceptional capabilities for a wide range of applications. This integrated circuit, encapsulated in a 456-pin FBGA package, is designed to meet the demands of complex digital processing tasks. It supports a vast array of logic operations with its robust architecture, enabling the creation of highly customized digital circuits tailored to specific technological needs. With 333 configurable I/O pins, this FPGA provides ample flexibility for interfacing with a multitude of other devices and systems, making it a cornerstone component in advanced electronic designs.

XC3S1000L-4FGG456C Features

This AMD Xilinx FPGA stands out for its versatile features, including a high gate count which facilitates the implementation of complex algorithms and logic circuits in a single chip. The 456FBGA package ensures compactness and robustness, making it suitable for space-constrained applications while maintaining high thermal and signal integrity. Additionally, the FPGA is designed for low power consumption, helping to maintain efficiency in high-performance systems.

XC3S1000L-4FGG456C Applications

  • Telecommunications: Utilized in networking equipment such as routers and switches, the XC3S1000L-4FGG456C enhances signal processing capabilities and supports rapid data flow management.
  • Automotive Systems: Applies in driver assistance systems where real-time processing of sensor data is critical for decision-making and vehicle control.
  • Consumer Electronics: Integrated into devices such as smart TVs and gaming consoles, this FPGA supports sophisticated user interfaces and high-speed graphic operations.
  • Medical Devices: Crucial for the design of medical imaging systems, where it processes complex algorithms rapidly to deliver real-time imaging results.
  • Industrial Automation: Helps in controlling machinery and processes, improving the efficiency and safety of manufacturing operations.
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