XC3S1000-5FTG256C

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Mfr.Part #
XC3S1000-5FTG256C
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 173 I/O 256FTBGA
Stock
883
In Stock :
883

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Speed Grade :
5
Published :
2006
Pbfree Code :
yes
JESD-609 Code :
e1
ECCN Code :
EAR99
Base Part Number :
XC3S1000
Width :
17mm
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
17280
Operating Temperature :
0°C~85°C TJ
Mounting Type :
Surface Mount
Terminal Form :
Ball
Number of Gates :
1000000
Voltage - Supply :
1.14V~1.26V
Pin Count :
256
Number of Pins :
256
Total RAM Bits :
442368
Supply Voltage :
1.2V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s) :
30
Operating Supply Voltage :
1.2V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
173
Factory Lead Time :
10 Weeks
Qualification Status :
Not Qualified
Terminal Pitch :
1mm
Mount :
Surface Mount
RoHS Status :
ROHS3 Compliant
Number of Outputs :
173
RAM Size :
54kB
Number of Terminations :
256
Length :
17mm
Peak Reflow Temperature (Cel) :
260
Package / Case :
256-LBGA
Series :
Spartan®-3
Number of LABs/CLBs :
1920
Packaging :
Tray
Datasheets
XC3S1000-5FTG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-5FTG256C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC3S1000, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Number of Pins:256, Number of Terminations:256, Package / Case:256-LBGA, XC3S1000-5FTG256C pinout, XC3S1000-5FTG256C datasheet PDF, XC3S1000-5FTG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S1000-5FTG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S1000-5FTG256C


FPGAs AMD Xilinx XC3S1000-5FTG256C Overview

The AMD Xilinx XC3S1000-5FTG256C FPGA is a cutting-edge field programmable gate array that offers high performance and flexibility for a wide range of applications. This device is designed to cater to demanding computing environments, enabling engineers to optimize logic density, system speed, and power efficiency. With its 173 I/O pins housed in a compact 256FTBGA package, the XC3S1000-5FTG256C provides robust interfacing capabilities, making it an ideal choice for integrating into complex digital systems. As businesses look to scale their operations and improve technological capabilities, the FPGAs AMD Xilinx XC3S1000-5FTG256C emerges as a pivotal tool in advancing next-generation electronic products.

XC3S1000-5FTG256C Features

This FPGA offers a dynamic suite of features designed to support advanced digital applications. Key attributes include a large number of programmable logic cells, comprehensive support for advanced digital signal processing, and high-speed serial connectivity. Additionally, the device's low-power consumption and high reliability make it suitable for both industrial-grade and consumer-grade applications.

XC3S1000-5FTG256C Applications

  • Communications Equipment: Utilized in routers, switches, and base stations, the XC3S1000-5FTG256C enhances processing capabilities and supports high-speed data transmission.
  • Consumer Electronics: Integral in the development of multimedia devices, gaming consoles, and smart TVs, providing flexible interfacing and high-speed computing.
  • Automotive Systems: Applied in vehicle navigation systems, infotainment units, and advanced driver-assistance systems (ADAS), ensuring reliable performance under rigorous conditions.
  • Industrial Automation: Used in machine control systems and industrial robots, offering robust control and real-time processing capabilities.
  • Medical Devices: Critical in the design of medical imaging systems and diagnostic equipment, supporting complex signal processing tasks and enhancing operational efficiency.
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