S29GL512S10FHI023
- Mfr.Part #
- S29GL512S10FHI023
- Manufacturer
- Infineon Technologies
- Package / Case
- 64-LBGA
- Datasheet
- Download
- Description
- IC FLASH 512MBIT PARALLEL 64BGA
- Stock
- 2,869
- In Stock :
- 2,869
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Memory Density :
- 536870912 bit
- Number of Terminations :
- 64
- Supply Voltage-Max (Vsup) :
- 3.6V
- Number of Functions :
- 1
- Standby Current-Max :
- 0.0001A
- Series :
- GL-S
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Interface :
- Parallel
- Surface Mount :
- yes
- Terminal Pitch :
- 1mm
- Supply Voltage-Min (Vsup) :
- 2.7V
- Supply Voltage :
- 3V
- Write Cycle Time - Word, Page :
- 60ns
- Height Seated (Max) :
- 1.4mm
- Terminal Position :
- BOTTOM
- Memory Type :
- Non-Volatile
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Power Supplies :
- 3/3.3V
- HTS Code :
- 8542.32.00.51
- Supply Current-Max :
- 0.08mA
- Qualification Status :
- Not Qualified
- Number of Pins :
- 64
- Page Size :
- 16words
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Packaging :
- Tape and Reel (TR)
- Width :
- 11mm
- Sector Size :
- 64K
- Organization :
- 32MX16
- Peak Reflow Temperature (Cel) :
- 260
- Length :
- 13mm
- Factory Lead Time :
- 13 Weeks
- Voltage - Supply :
- 2.7V~3.6V
- Memory Width :
- 16
- Number of Sectors/Size :
- 512
- Access Time :
- 100ns
- Ready/Busy :
- yes
- Operating Mode :
- ASYNCHRONOUS
- Common Flash Interface :
- yes
- Toggle Bit :
- yes
- Memory Size :
- 512Mb 32M x 16
- Programming Voltage :
- 2.7V
- Command User Interface :
- yes
- Data Polling :
- yes
- RoHS Status :
- ROHS3 Compliant
- Memory Format :
- Flash
- JESD-609 Code :
- e1
- Package / Case :
- 64-LBGA
- ECCN Code :
- 3A991.B.1.A
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -40°C~85°C TA
- Datasheets
- S29GL512S10FHI023

Memory Infineon Technologies S29GL512S10FHI023 Overview
The Memory Infineon Technologies S29GL512S10FHI023 is a state-of-the-art IC FLASH device that boasts a substantial 512Mbit storage capacity, all packed into a compact 64BGA (Ball Grid Array) package. Engineered by Infineon Technologies, a leader in semiconductor innovation, this flash memory chip offers high-speed, reliable performance tailored for advanced digital storage applications. Designed for durability and efficiency, it ensures optimal functionality in a variety of demanding operational environments. The inclusion of parallel interface technology facilitates rapid data transfer rates, making it an ideal choice for industries looking for robust data handling solutions.
S29GL512S10FHI023 Features
This particular model of IC flash memory is renowned for its high density and speed, supporting advanced parallel interfaces for enhanced data throughput and minimal latency. The 64BGA package is not only space-efficient but also ensures improved thermal management and reduced power consumption, making it suitable for power-sensitive applications. Additionally, its robust design provides a reliable storage solution even under harsh environmental conditions.
S29GL512S10FHI023 Applications
- Automotive Systems: Utilized in car infotainment systems and advanced driver-assistance systems (ADAS), where high-speed, reliable memory is crucial for performance and safety.
- Industrial Automation: Serves as a key component in industrial control systems, where durability and the ability to handle large volumes of data quickly are paramount.
- Telecommunications: Used in network equipment such as routers and switches, enhancing performance with its high bandwidth capabilities.
- Consumer Electronics: Integral for applications in high-performance consumer electronics, such as digital cameras and gaming consoles, where quick access to large amounts of data is necessary.
- Medical Devices: Applied in medical imaging systems, where fast and reliable data storage is essential to handle complex imaging data effectively.
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