NAND512W3A2DN6E

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Mfr.Part #
NAND512W3A2DN6E
Manufacturer
Micron Technology
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Datasheet
Download
Description
IC FLASH 512MBIT PARALLEL 48TSOP
Stock
6,612
In Stock :
6,612

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Manufacturer :
Micron Technology
Product Category :
Memory
Terminal Pitch :
0.5mm
Length :
18.4mm
Number of Pins :
48
Voltage - Supply :
2.7V~3.6V
Peak Reflow Temperature (Cel) :
260
Packaging :
Tray
RoHS Status :
ROHS3 Compliant
Density :
512 Mb
Standby Current-Max :
0.00005A
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Interface :
Parallel
Memory Width :
8
Supply Voltage-Max (Vsup) :
3.6V
Number of Terminations :
48
JESD-609 Code :
e3
Address Bus Width :
26b
Command User Interface :
yes
Sector Size :
16k
Supply Voltage-Min (Vsup) :
2.7V
Memory Type :
Non-Volatile
Programming Voltage :
3V
Radiation Hardening :
No
Time@Peak Reflow Temperature-Max (s) :
30
Nominal Supply Current :
30mA
Access Time (Max) :
35 ns
Published :
2010
Height Seated (Max) :
1.2mm
Number of Sectors/Size :
4k
Data Polling :
No
Package / Case :
48-TFSOP (0.724, 18.40mm Width)
Word Size :
8B
Base Part Number :
NAND512-A
Page Size :
512B
Operating Temperature :
-40°C~85°C TA
Terminal Finish :
Matte Tin (Sn)
Mount :
Surface Mount
Mounting Type :
Surface Mount
Organization :
64MX8
Write Cycle Time - Word, Page :
50ns
Supply Voltage :
3V
Number of Functions :
1
Toggle Bit :
No
Ready/Busy :
yes
Memory Size :
512Mb 64M x 8
Terminal Position :
Dual
Memory Format :
Flash
Sync/Async :
ASYNCHRONOUS
Power Supplies :
3/3.3V
Datasheets
NAND512W3A2DN6E
Introducing Memory Micron Technology NAND512W3A2DN6E from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:48, Number of Terminations:48, Package / Case:48-TFSOP (0.724, 18.40mm Width), Base Part Number:NAND512-A, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, NAND512W3A2DN6E pinout, NAND512W3A2DN6E datasheet PDF, NAND512W3A2DN6E amp .Beyond Memory Micron Technology NAND512W3A2DN6E ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology NAND512W3A2DN6E


Memory Micron Technology NAND512W3A2DN6E Overview

Introducing the Memory Micron Technology NAND512W3A2DN6E, a high-capacity 512 Mbit flash memory IC crafted for robust performance and reliability. Manufactured by Micron Technology, this component is housed in a 48TSOP package, offering excellent durability and functionality in a compact form. Engineered for versatility, the NAND512W3A2DN6E addresses the increasing demands for substantial data storage in industrial and commercial applications. Its parallel interface ensures swift data transfer rates, making it an ideal choice for systems requiring fast access and high-speed programming of large volumes of data. This product's precision and efficiency make it an attractive option for businesses looking to leverage advanced memory solutions for enhanced system performance.

NAND512W3A2DN6E Features

The NAND512W3A2DN6E IC FLASH from Micron Technology stands out with its 512 Mbit storage capacity, allowing extensive data handling and storage. The 48TSOP package ensures a minimal footprint on the system board while providing high reliability and strength in physical structure. It supports a parallel interface for high-speed communication, which significantly optimizes programming and reading processes. Designed for endurance, this memory IC can withstand intense operational environments, making it highly suitable for various demanding applications.

NAND512W3A2DN6E Applications

  • Consumer Electronics: Used in devices like digital cameras and audio players, where large, non-volatile storage is crucial for user data such as photos and music files.
  • Automotive Systems: Integrated in automotive infotainment systems to store navigational data and multimedia content, enhancing the in-vehicle user experience.
  • Industrial Automation: Applied in control systems for logging and data storage, providing reliable data retrieval and storage solutions that are vital for process management and operational reliability.
  • Telecommunication Infrastructure: Utilized in network equipment for firmware storage, helping maintain system stability and support upgrades and functionality enhancements.
  • Mobile Technology: Serves as a storage solution for mobile devices, supporting applications and user data that require high-density and durable memory components.
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