NAND02GR3B2DZA6E

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Mfr.Part #
NAND02GR3B2DZA6E
Manufacturer
Micron Technology
Package / Case
63-TFBGA
Datasheet
Download
Description
IC FLASH 2GBIT PARALLEL 63VFBGA
Stock
41,806
In Stock :
41,806

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Manufacturer :
Micron Technology
Product Category :
Memory
Supply Voltage-Max (Vsup) :
1.95V
Number of Functions :
1
Operating Temperature :
-40°C~85°C TA
Published :
2008
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Toggle Bit :
No
HTS Code :
8542.32.00.51
Height Seated (Max) :
1.05mm
Command User Interface :
yes
Standby Current-Max :
0.00005A
Supply Voltage-Min (Vsup) :
1.7V
Ready/Busy :
yes
Nominal Supply Current :
20mA
Memory Format :
Flash
Sync/Async :
ASYNCHRONOUS
Density :
2 GB
Data Polling :
No
RoHS Status :
ROHS3 Compliant
Length :
11mm
Number of Pins :
63
Number of Terminations :
63
Package / Case :
63-TFBGA
Mount :
Surface Mount
Voltage - Supply :
1.7V~1.95V
Terminal Position :
BOTTOM
Terminal Pitch :
0.8mm
Pin Count :
63
Terminal Finish :
TIN SILVER COPPER
Memory Width :
8
Peak Reflow Temperature (Cel) :
260
Memory Size :
2Gb 256M x 8
Organization :
256MX8
Radiation Hardening :
No
Time@Peak Reflow Temperature-Max (s) :
30
Page Size :
2kB
Base Part Number :
NAND02G
ECCN Code :
3A991.B.1.A
JESD-609 Code :
e1
Write Cycle Time - Word, Page :
45ns
Operating Supply Voltage :
1.8V
Sector Size :
128K
Access Time (Max) :
25000 ns
Packaging :
Tray
Mounting Type :
Surface Mount
Word Size :
8B
Memory Type :
Non-Volatile
Supply Voltage :
1.8V
Number of Sectors/Size :
2k
Address Bus Width :
8B
Datasheets
NAND02GR3B2DZA6E
Introducing Memory Micron Technology NAND02GR3B2DZA6E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Number of Pins:63, Number of Terminations:63, Package / Case:63-TFBGA, Base Part Number:NAND02G, Mounting Type:Surface Mount, NAND02GR3B2DZA6E pinout, NAND02GR3B2DZA6E datasheet PDF, NAND02GR3B2DZA6E amp .Beyond Memory Micron Technology NAND02GR3B2DZA6E ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology NAND02GR3B2DZA6E


Memory Micron Technology NAND02GR3B2DZA6E Overview

The Memory Micron Technology NAND02GR3B2DZA6E is a state-of-the-art IC FLASH 2GBit device designed for high-speed and high-density storage solutions. Encased in a compact 63VFBGA package, this NAND flash memory offers a robust data storage solution for a variety of demanding applications. With its parallel interface, it provides an excellent balance of performance, power consumption, and cost, making it an ideal choice for bulk purchases by B2B customers seeking reliable and efficient memory components.

NAND02GR3B2DZA6E Features

This product incorporates several key features including high-density storage capacity of 2 Gbit and a parallel interface that enhances data transfer speeds. The 63VFBGA packaging not only ensures a compact footprint but also enhances thermal management and reliability under varied operational conditions. Designed for efficiency, the NAND02GR3B2DZA6E also supports a wide range of operating temperatures, making it versatile for various industrial applications.

NAND02GR3B2DZA6E Applications

  • Consumer Electronics: Utilized in devices such as smartphones, tablets, and digital cameras for storing large amounts of data including applications, media files, and high-resolution images. The high-speed interface ensures quick access and storage of data, enhancing device performance.
  • Industrial Automation: In automation systems, this NAND flash memory is used for logging extensive datasets and operation algorithms, which are crucial for real-time processing and machine learning applications.
  • Automotive Applications: Suitable for use in advanced driver-assistance systems (ADAS) where high-density, fast-access flash memory is required to process and store sensor data, contributing to vehicle safety and functionality.
  • Internet of Things (IoT) Devices: Acts as a primary storage solution for firmware and data in smart home devices and other IoT applications, where durability and the ability to handle large cycles of data writing and erasure are critical.
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Shipping Cost

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