NAND512R3A2BZA6E
- Mfr.Part #
- NAND512R3A2BZA6E
- Manufacturer
- STMicroelectronics
- Package / Case
- 63-VFBGA
- Datasheet
- Download
- Description
- IC FLSH 512MBIT PARALLEL 63VFBGA
- Stock
- 40,488
- In Stock :
- 40,488
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- Manufacturer :
- STMicroelectronics
- Product Category :
- Memory
- Standby Current-Max :
- 0.00005A
- Command User Interface :
- yes
- Toggle Bit :
- No
- Memory Format :
- Flash
- Memory Interface :
- Parallel
- Voltage - Supply :
- 1.7V~1.95V
- Page Size :
- 512words
- Sector Size :
- 16k
- Memory Density :
- 536870912 bit
- Number of Functions :
- 1
- Qualification Status :
- Not Qualified
- Number of Terminations :
- 63
- Length :
- 11mm
- Programming Voltage :
- 1.8V
- Pin Count :
- 63
- Terminal Position :
- BOTTOM
- Supply Voltage-Max (Vsup) :
- 1.95V
- Data Bus Width :
- 8B
- Organization :
- 64MX8
- Mounting Type :
- Surface Mount
- Number of Sectors/Size :
- 4k
- HTS Code :
- 8542.32.00.51
- RoHS Status :
- ROHS3 Compliant
- Memory Width :
- 8
- Ready/Busy :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Supply Voltage-Min (Vsup) :
- 1.7V
- Package / Case :
- 63-VFBGA
- Operating Temperature :
- -40°C~85°C TA
- Supply Current-Max :
- 0.015mA
- Operating Mode :
- ASYNCHRONOUS
- ECCN Code :
- 3A991.B.1.A
- Surface Mount :
- yes
- Power Supplies :
- 1.8V
- Data Polling :
- No
- Memory Type :
- Non-Volatile
- Number of Pins :
- 55
- Access Time (Max) :
- 15000 ns
- Terminal Pitch :
- 0.8mm
- Packaging :
- Tray
- Memory Size :
- 512Mb 64M x 8
- Base Part Number :
- NAND512
- Write Cycle Time - Word, Page :
- 60ns
- Height Seated (Max) :
- 1.05mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 1.8V
- JESD-30 Code :
- R-PBGA-B63
- Datasheets
- NAND512R3A2BZA6E

Memory STMicroelectronics NAND512R3A2BZA6E Overview
The NAND512R3A2BZA6E from STMicroelectronics stands as a high-performance, 512 Mbit parallel flash memory IC, housed in a compact 63-VFBGA package. This Memory STMicroelectronics NAND512R3A2BZA6E product is tailored for applications requiring high-volume storage and swift data access. It integrates seamlessly into systems, offering a reliable and robust storage solution that is optimal for advanced industrial, automotive, and telecommunications needs. The device is designed to support rigorous data integrity and longevity, making it highly suitable for intensive operations that demand long-term reliability and high-speed data transactions.
NAND512R3A2BZA6E Features
The NAND512R3A2BZA6E flash memory IC features a large 512 Mbit storage capacity with a parallel interface for enhanced data transfer speeds. The package's small footprint, 63-VFBGA, ensures minimal space usage, making it ideal for densely packed PCBs. With advanced wear-leveling and error correction code (ECC) capabilities, it enhances the stability and reliability of data storage and retrieval processes.
NAND512R3A2BZA6E Applications
- Embedded Systems: The high storage capacity and fast access times make it suitable for use in complex embedded systems like industrial controllers and automotive electronics, where durable and reliable memory is crucial.
- Telecommunications: Utilized in telecommunications equipment for storing firmware and other critical data that require quick retrieval to maintain system performance and reliability.
- Consumer Electronics: Applied in consumer electronics such as set-top boxes and digital TVs where large volume storage and high data integrity are necessary for user settings and multimedia content.
- Internet of Things (IoT) Devices: Ideal for IoT devices requiring extensive memory for data logging and firmware updates, ensuring long-term functionality and performance.
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