NAND256W3A2BZAXE

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Mfr.Part #
NAND256W3A2BZAXE
Manufacturer
Micron Technology
Package / Case
55-TFBGA
Datasheet
Download
Description
IC FLSH 256MBIT PARALLEL 55VFBGA
Stock
16,576
In Stock :
16,576

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Manufacturer :
Micron Technology
Product Category :
Memory
Radiation Hardening :
No
Data Polling :
No
Access Time (Max) :
45 ns
Voltage - Rated DC :
3.3V
Memory Type :
Non-Volatile
Operating Supply Voltage :
3V
Terminal Pitch :
0.8mm
Number of Terminations :
55
Supply Voltage :
3V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Write Cycle Time - Word, Page :
50ns
Number of Functions :
1
Memory Size :
256Mb 32M x 8
Standby Current-Max :
0.00005A
Sector Size :
16k
Number of Sectors/Size :
2k
Operating Temperature :
-40°C~85°C TA
Density :
256 Mb
RoHS Status :
ROHS3 Compliant
Supply Current-Max :
0.02mA
Mounting Type :
Surface Mount
Memory Interface :
Parallel
Package / Case :
55-TFBGA
Organization :
32MX8
Packaging :
Tray
Voltage :
3.3V
Base Part Number :
NAND256
Height Seated (Max) :
1.05mm
Memory Format :
Flash
Factory Lead Time :
4 Weeks
Surface Mount :
yes
Command User Interface :
yes
Page Size :
528B
Number of Pins :
55
Length :
10mm
Memory Width :
8
Address Bus Width :
25b
Published :
2004
Terminal Position :
BOTTOM
Ready/Busy :
yes
Toggle Bit :
No
Voltage - Supply :
2.7V~3.6V
Datasheets
NAND256W3A2BZAXE
Introducing Memory Micron Technology NAND256W3A2BZAXE from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:55, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Package / Case:55-TFBGA, Voltage:3.3V, Base Part Number:NAND256, Number of Pins:55, NAND256W3A2BZAXE pinout, NAND256W3A2BZAXE datasheet PDF, NAND256W3A2BZAXE amp .Beyond Memory Micron Technology NAND256W3A2BZAXE ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.



Memory IC NAND256 256 Mb kb 10mm mm

NAND256W3A2BZAXE Overview


In this case, the memory type of the device can be classified as Non-Volatile. Case Tray is available. An embedded 55-TFBGA case surrounds memory ics. It is estimated that the memory size on the chip is 256Mb 32M x 8. As with most mainstream devices, this one uses FLASH-format memory. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. It is recommended to mount it in the Surface Mount mounting type. It is planted on the chip with 55 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 3V to be supplied to this ic memory chip in order to operate. A device's base part number, NAND256, is often used in order to identify similar components. The ic memory chip comes in a package with 55 pins that allows it to be connected to a computer. It is noted that the operating supply voltage of this memory is 3V. In terms of power consumption, it can operate at a maximum supply of 0.02mA . Total, there are 2K specifically sized divisions within this memory. As for the voltage, the ic memory chip is able to operate well under a voltage of 3.3V volts.

NAND256W3A2BZAXE Features


Package / Case: 55-TFBGA
55 Pins
Operating Supply Voltage:3V


NAND256W3A2BZAXE Applications


There are a lot of Micron Technology Inc.
NAND256W3A2BZAXE Memory applications.


  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
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