NAND256W3A2BZA6E
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- Mfr.Part #
- NAND256W3A2BZA6E
- Manufacturer
- Micron Technology
- Package / Case
- 55-TFBGA
- Datasheet
- Download
- Description
- IC FLSH 256MBIT PARALLEL 55VFBGA
- Stock
- 22,221
- In Stock ：
- 22,221
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- Manufacturer :
- Micron Technology
- Product Category :
- Memory
- Radiation Hardening :
- No
- Voltage :
- 3V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Sectors/Size :
- 2k
- Standby Current-Max :
- 0.00005A
- Density :
- 256 Mb
- Published :
- 2004
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 3V
- Nominal Supply Current :
- 20mA
- Address Bus Width :
- 25b
- JESD-609 Code :
- e1
- Word Size :
- 8B
- Voltage - Supply :
- 2.7V~3.6V
- Memory Format :
- Flash
- Memory Type :
- Non-Volatile
- Toggle Bit :
- No
- Data Polling :
- No
- Terminal Pitch :
- 0.8mm
- JESD-30 Code :
- R-PBGA-B55
- Number of Terminations :
- 55
- Voltage - Rated DC :
- 3V
- HTS Code :
- 8542.32.00.51
- Page Size :
- 512words
- Height Seated (Max) :
- 1.05mm
- Access Time (Max) :
- 35 ns
- Memory Interface :
- Parallel
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 260
- Number of Functions :
- 1
- Pin Count :
- 55
- Write Cycle Time - Word, Page :
- 50ns
- Number of Pins :
- 48
- Length :
- 10mm
- Ready/Busy :
- yes
- Package / Case :
- 55-TFBGA
- Mounting Type :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Sync/Async :
- ASYNCHRONOUS
- Mount :
- Surface Mount
- Pbfree Code :
- yes
- Terminal Finish :
- TIN SILVER COPPER
- Command User Interface :
- yes
- Base Part Number :
- NAND256-A
- Memory Width :
- 8
- Organization :
- 32MX8
- Sector Size :
- 16k
- Memory Size :
- 256Mb 32M x 8
- Terminal Position :
- BOTTOM
- Operating Temperature :
- -40°C~85°C TA
- ECCN Code :
- 3A991.B.1.A
- Datasheets
- NAND256W3A2BZA6E
Surface Mount 55 Pin Memory IC NAND256-A 256 Mb kb 10mm mm 20mA mA 8b b
NAND256W3A2BZA6E Overview
In this case, the memory type of the device can be classified as Non-Volatile. Case Tray is available. An embedded 55-TFBGA case surrounds memory ics. It is estimated that the memory size on the chip is 256Mb 32M x 8. As with most mainstream devices, this one uses FLASH-format memory. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. It is recommended to mount it in the Surface Mount mounting type. It is planted on the chip with 55 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 3V to be supplied to this ic memory chip in order to operate. A device's base part number, NAND256-A, is often used in order to identify similar components. The ic memory chip comes in a package with 48 pins that allows it to be connected to a computer. The memory device has a total of 55 pins, thus indicating that it has a total of 55 memory locations. This chip uses Surface Mount mounting, a straightforward, high-efficiency method of mounting. It is rated 20mA for its nominal supply current when it comes to the memory component. Total, there are 2K specifically sized divisions within this memory. As for the voltage, the ic memory chip is able to operate well under a voltage of 3V volts.
NAND256W3A2BZA6E Features
Package / Case: 55-TFBGA
48 Pins
NAND256W3A2BZA6E Applications
There are a lot of Micron Technology Inc.
NAND256W3A2BZA6E Memory applications.
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
- data buffer
- nonvolatile BIOS memory
- Camcorders
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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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