NAND08GW3F2AN6E

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Mfr.Part #
NAND08GW3F2AN6E
Manufacturer
Micron Technology
Package / Case
48-TFSOP (0.724, 18.40mm Width)
Datasheet
Download
Description
IC FLASH 8GBIT PARALLEL 48TSOP
Stock
7,577
In Stock :
7,577

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Manufacturer :
Micron Technology
Product Category :
Memory
Memory Size :
8Gb 1G x 8
Published :
2009
Reach Compliance Code :
Unknown
Voltage - Supply :
2.7V~3.6V
Memory Type :
Non-Volatile
Package / Case :
48-TFSOP (0.724, 18.40mm Width)
Mounting Type :
Surface Mount
Write Cycle Time - Word, Page :
25ns
Operating Temperature :
-40°C~85°C TA
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
Flash
RoHS Status :
ROHS3 Compliant
Base Part Number :
NAND08G
Packaging :
Tray
Datasheets
NAND08GW3F2AN6E
Introducing Memory Micron Technology NAND08GW3F2AN6E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:48-TFSOP (0.724, 18.40mm Width), Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Base Part Number:NAND08G, NAND08GW3F2AN6E pinout, NAND08GW3F2AN6E datasheet PDF, NAND08GW3F2AN6E amp .Beyond Memory Micron Technology NAND08GW3F2AN6E ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Micron Technology NAND08GW3F2AN6E


Memory Micron Technology NAND08GW3F2AN6E Overview

Introducing the NAND08GW3F2AN6E from Micron Technology, a robust IC FLASH component designed to meet the rigorous demands of high-volume storage solutions. This 8Gbit flash memory chip, encapsulated in a compact 48TSOP package, stands out in the industry for its reliability and high performance. As businesses increasingly seek durable and efficient storage solutions, the Memory Micron Technology NAND08GW3F2AN6E serves as a pivotal component in a range of applications, providing substantial benefits in terms of storage density and stability. Its parallel interface ensures a smooth integration with existing technologies, making it an ideal choice for manufacturers looking to upgrade or design new systems that require long-term, reliable data storage.

NAND08GW3F2AN6E Features

  • High Density: 8Gbit of storage capacity allows for extensive data management and retention.
  • Parallel Interface: Ensures easy and reliable integration with mainstream technologies and systems.
  • Compact Form Factor: 48TSOP package allows for efficient use of space in tight design parameters.
  • High Reliability: Manufactured by Micron Technology, known for its quality and durability in memory technologies.
  • Low Power Consumption: Designed for efficiency, reducing operational costs and enhancing system performance.

NAND08GW3F2AN6E Applications

  • Consumer Electronics: Utilized in devices like digital cameras and MP3 players where high capacity and durability are necessary for storing large amounts of multimedia files.
  • Mobile Devices: Employs in smartphones and tablets to enhance memory capacity without compromising on device size and battery life.
  • Embedded Systems: Critical in applications such as GPS systems, where reliable, long-term data storage is essential for functionality and performance.
  • Networking Equipment: Used in routers and switches, facilitating improved data logging and firmware updates that require high-speed, reliable memory solutions.
  • Industrial Applications: Integrated into machinery and control systems that require robust, high-capacity memory for logging extensive data and operational parameters.
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Shipping Cost

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