M83513/13-C01NP

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Mfr.Part #
M83513/13-C01NP
Manufacturer
ITT Cannon
Package / Case
Datasheet
Download
Description
MICRO-D RECEPTACLE 21POS R/A PCB
Stock
82
In Stock :
82

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Manufacturer :
ITT Cannon
Product Category :
D-Sub Connector Assemblies
Number of Rows :
2
Total Number of Contacts :
21
Insulation Resistance :
5000000000 Ω
Shell Plating :
Electroless Nickel
Mating Information :
MULTIPLE MATING PARTS AVAILABLE
Reference Standard :
MIL
Mounting Angle :
RIGHT ANGLE
Less Contact :
No
Maximum Operating Temperature (°C) :
150
Contact Arrangement :
S21P0
Mounting Style :
Panel
Board Mounting Option :
HOLE.096
Body/Shell Style :
Receptacle
MIL Conformance :
No
Subcategory :
MIL-Spec / MIL-Type
Number of Contacts :
21
Manufacturer :
Glenair
Insulation :
Not Insulated
Product Type :
D-Sub MIL Spec Connectors
Body Depth :
0.425 inch
Contact Gender :
SKT
Contact Pattern :
STAGGERED
RoHS Status :
RoHS Compliant
Shell Finish :
Nickel
Number of Positions :
21 Position
Terminal Pitch :
2.54 mm
Pitch :
2.5400 mm
Shell Material :
Aluminum
Mating Contact Pitch :
0.05 inch
Terminal Length :
0.109 inch
Insertion Force-Max :
2.78 N
Termination Method :
Solder
Operating Temperature :
-55 to 150 °C
ECCN (US) :
EAR99
Termination Style :
Through Hole
Type :
Micro D-Subminiature
PCB Contact Pattern :
STAGGERED
Reach Compliance Code :
Compliant
Product Length :
27.56 mm
Minimum Operating Temperature (°C) :
-55
Dielectric Withstanding Voltage :
600VAC V
Empty Shell :
No
Series :
M83513
Tradename :
MIL-DTL-83513
Durability :
500 Cycles
Withdrawl Force-Min :
0.139 N
Product Status :
Active
Insulation Resistance (MOhm) :
5000
Contact Resistance :
8 mΩ
Mating Cycle (Cycles) :
500
Filter Feature :
No
Number of Terminals :
21
Terminal Pitch (mm) :
1.27
Package :
Bulk
Current Rating :
3 A
Product Category :
D-Sub MIL Spec Connectors
Mounting Option 2 :
JACKPOST
Base/Housing Material :
Aluminum
Number Of PCB Rows :
3
Reliability :
MIL-C-83513
Brand :
Glenair
Contact Plating :
Gold Over Nickel
Product Depth (mm) :
15.75
Product :
Connectors
Body Breadth :
0.325 inch
Rated Current (Signal) :
3 A
IEC Conformance :
No
Termination Type :
Solder
Mounting Option 1 :
#2-56
Mixed Contacts :
No
PCB Contact Row Spacing :
2.54 mm
Mounting Type :
BOARD
Body Orientation :
RIGHT ANGLE
RoHS :
Details
DIN Conformance :
No
Product Height (mm) :
7.87
Qualification :
EREL
Product Length (mm) :
27.56
Contact Material :
Phosphor Bronze
Number of Ports :
1
Additional Feature :
STANDARD: MIL-DTL-83513
Contact Style :
RND PIN-SKT
Mating Contact Row Spacing :
0.043 inch
Maximum Contact Resistance (mOhm) :
8
Mounting :
Through Hole
Gender :
RCP
Maximum Current Rating (A) :
3
Plating Thickness :
50u inch
Shell Size :
C
Option :
GENERAL PURPOSE
Connector Type :
D MICROMINIATURE CONNECTOR
Datasheets
M83513/13-C01NP
Introducing D-Sub Connector Assemblies ITT Cannon M83513/13-C01NP from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-55 to 150 °C, Type:Micro D-Subminiature, Mounting Type:BOARD, M83513/13-C01NP pinout, M83513/13-C01NP datasheet PDF, M83513/13-C01NP amp .Beyond D-Sub Connector Assemblies ITT Cannon M83513/13-C01NP ,we also offer ICD15S13E4GX00LF, L77SDEH09SOL2RM5, A-DF 25 A/KG-T2S, Our vast inventory has you covered. Contact us now for immediate solutions.

ITT Cannon M83513/13-C01NP


M83513 Series D MICROMINIATURE CONNECTOR 21 Position-Position RCP BOARD Phosphor Bronze

M83513/13-C01NP Overview


Packaging for this item is D MICROMINIATURE CONNECTOR.BOARD is the type of mounting for the device.The product is a member of the M83513 Series.Among other features are STANDARD: MIL-DTL-83513, to name only a few.The device has 1 ports for managing a variety of tasks.It operates at an operating temperature of -55 to 150 °C.

M83513/13-C01NP Features


M83513 series


M83513/13-C01NP Applications


There are a lot of Glenair
M83513/13-C01NP D-Sub Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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