M83513/10-D01NP

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Mfr.Part #
M83513/10-D01NP
Manufacturer
Cinch Connectivity Solutions
Package / Case
Datasheet
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Description
CONN MICRO-D PLUG 25POS R/A SLDR
Stock
32
In Stock :
32

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Manufacturer :
Cinch Connectivity Solutions
Product Category :
D-Sub Connector Assemblies
Maximum Operating Temperature (°C) :
150
Series :
M83513
Gender :
PL
Termination Type :
Solder
Number of Contacts :
25
Product Category :
D-Sub MIL Spec Connectors
Connector Type :
D MICROMINIATURE CONNECTOR
Body/Shell Style :
PLUG
Terminal Pitch :
2.54 mm
Product Length (mm) :
30.01
Product :
Connectors
PCB Contact Row Spacing :
2.54 mm
Termination Method :
Solder
DIN Conformance :
No
Mounting Style :
PCB Mount
Withdrawl Force-Min :
0.139 N
Rated Current (Signal) :
3 A
Current Rating :
3 A
Body Depth :
0.425 inch
Product Depth (mm) :
15.45
Contact Resistance :
8 mΩ
Contact Style :
RND PIN-SKT
Body Orientation :
RIGHT ANGLE
Reach Compliance Code :
Compliant
Mixed Contacts :
No
Mating Cycle (Cycles) :
500
JESD-609 Code :
e0
Less Contact :
No
Mounting Option 2 :
JACKPOST
Number Of PCB Rows :
3
Brand :
Glenair
Shell Plating :
Electroless Nickel
Contact Plating :
Gold Over Nickel
Type :
Micro D-Subminiature
Durability :
500 Cycles
Mounting :
Through Hole
Insulation Resistance :
5000000000 Ω
Mounting Type :
BOARD
Contact Gender :
Pin
Maximum Current Rating (A) :
3
ECCN (US) :
EAR99
Terminal Length :
0.109 inch
Number of Positions :
25 Position
Operating Temperature :
-55 to 150 °C
HTS Code :
8536.69.40.30
Insulation :
Not Insulated
Pitch :
2.5400 mm
Option :
GENERAL PURPOSE
Contact Material :
BERYLLIUM COPPER
Factory Lead Time :
9 Weeks
Tradename :
MIL-DTL-83513
PCB Contact Pattern :
STAGGERED
Contact Arrangement :
S25P0
Mating Information :
MULTIPLE MATING PARTS AVAILABLE
Maximum Contact Resistance (mOhm) :
8
Dielectric Withstanding Voltage :
600VAC V
Number of Rows :
2
Product Height (mm) :
7.87
Additional Feature :
STANDARD: MIL-DTL-83513
Shell Size :
D
Insertion Force-Max :
2.78 N
Contact Finish Termination :
TIN LEAD
Plating Thickness :
50u inch
Manufacturer :
Glenair
Contact Pattern :
STAGGERED
Shell Finish :
Nickel
Subcategory :
MIL-Spec / MIL-Type
Mating Contact Row Spacing :
0.043 inch
Mounting Angle :
RIGHT ANGLE
MIL Conformance :
yes
Base/Housing Material :
Aluminum
Product Length :
30.01 mm
Body Breadth :
0.325 inch
Minimum Operating Temperature (°C) :
-55
Number of Terminals :
25
Reference Standard :
MIL
Insulation Resistance (MOhm) :
5000
Empty Shell :
No
ECCN Code :
EAR99
Termination Style :
Through Hole
Filter Feature :
No
Mounting Option 1 :
#2-56
Mating Contact Pitch :
0.05 inch
Product Type :
D-Sub MIL Spec Connectors
RoHS Status :
RoHS Compliant
Shell Material :
Aluminum
HTS :
8536.69.40.40
Board Mounting Option :
HOLE.096
IEC Conformance :
No
RoHS :
In Transition
Number of Ports :
1
Terminal Pitch (mm) :
0.64
Total Number of Contacts :
25
Datasheets
M83513/10-D01NP
Introducing D-Sub Connector Assemblies Cinch Connectivity Solutions M83513/10-D01NP from Chip IC,where excellence meets affordability. This product stands out with its Type:Micro D-Subminiature, Mounting Type:BOARD, Operating Temperature:-55 to 150 °C, M83513/10-D01NP pinout, M83513/10-D01NP datasheet PDF, M83513/10-D01NP amp .Beyond D-Sub Connector Assemblies Cinch Connectivity Solutions M83513/10-D01NP ,we also offer ICD15S13E4GX00LF, L77SDEH09SOL2RM5, A-DF 25 A/KG-T2S, Our vast inventory has you covered. Contact us now for immediate solutions.

Cinch Connectivity Solutions M83513/10-D01NP


M83513 Series D MICROMINIATURE CONNECTOR 25 Position-Position PL BOARD Beryllium Copper

M83513/10-D01NP Overview


Packaging for this item is D MICROMINIATURE CONNECTOR.BOARD is the type of mounting for the device.The product is a member of the M83513 Series.Among other features are STANDARD: MIL-DTL-83513, to name only a few.The device has 1 ports for managing a variety of tasks.It operates at an operating temperature of -55 to 150 °C.

M83513/10-D01NP Features


M83513 series


M83513/10-D01NP Applications


There are a lot of Glenair
M83513/10-D01NP D-Sub Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
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