IRG6S330UPBF

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Mfr.Part #
IRG6S330UPBF
Manufacturer
Infineon Technologies
Package / Case
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Datasheet
Download
Description
IGBT 330V 70A 160W D2PAK
Stock
15,360
In Stock :
15,360

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Manufacturer :
Infineon Technologies
Product Category :
Transistors - IGBTs - Single
Package / Case :
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Operating Temperature :
-40°C~150°C TJ
Gate Charge :
86nC
Test Condition :
196V, 25A, 10Ohm
Min Operating Temperature :
-40°C
Max Collector Current :
70A
Mounting Type :
Surface Mount
Element Configuration :
Single
Input Type :
Standard
Td (on/off) @ 25°C :
39ns/120ns
IGBT Type :
Trench
Power Dissipation :
160W
Supplier Device Package :
D2PAK
Number of Pins :
3
Max Power Dissipation :
160W
RoHS Status :
RoHS Compliant
Collector Emitter Voltage (VCEO) :
2.1V
Collector Emitter Saturation Voltage :
2.1V
Packaging :
Tube
Mount :
Surface Mount
Voltage - Collector Emitter Breakdown (Max) :
330V
Published :
2009
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Max Operating Temperature :
150°C
Collector Emitter Breakdown Voltage :
330V
Vce(on) (Max) @ Vge, Ic :
2.1V @ 15V, 70A
Power - Max :
160W
Radiation Hardening :
No
Current - Collector (Ic) (Max) :
70A
Datasheets
IRG6S330UPBF
Introducing Transistors - IGBTs - Single Infineon Technologies IRG6S330UPBF from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:TO-263-3, D2Pak (2 Leads + Tab), TO-263AB, Operating Temperature:-40°C~150°C TJ, Mounting Type:Surface Mount, Number of Pins:3, IRG6S330UPBF pinout, IRG6S330UPBF datasheet PDF, IRG6S330UPBF amp .Beyond Transistors - IGBTs - Single Infineon Technologies IRG6S330UPBF ,we also offer IXYT25N250CHV, IXYX140N120A4, IXYH30N450HV, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies IRG6S330UPBF


IRG6S330UPBF datasheet pdf and Transistors - IGBTs - Single product details from Infineon Technologies stock available at

IRG6S330UPBF Description

This IGBT is specifically designed for applications in Plasma Display Panels. This device utilizes advanced trench IGBT technology to achieve low VCE(on) and low EPULSETM rating per silicon area which improve panel efficiency. Additional features are 150°C operating junction temperature and high repetitive peak current capability. These features combine to make this IGBT a highly efficient, robust, and reliable device for PDP applications.



IRG6S330UPBF Features

Advanced Trench IGBT Technology

Optimized for Sustain and Energy Recovery circuits in PDP applications

Low VCE(on) and Energy per Pulse (EPULSETM) for improved panel efficiency

High repetitive peak current capability

Lead-Free package


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