IRFZ48VS
- Mfr.Part #
- IRFZ48VS
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Datasheet
- Download
- Description
- MOSFET N-CH 60V 72A D2PAK
- Stock
- 7,237
- In Stock :
- 7,237
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Additional Feature :
- AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE
- Number of Terminations :
- 2
- JESD-30 Code :
- R-PSSO-G2
- Case Connection :
- DRAIN
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Surface Mount :
- yes
- Qualification Status :
- Not Qualified
- ECCN Code :
- EAR99
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Series :
- HEXFET®
- Transistor Application :
- SWITCHING
- Avalanche Energy Rating (Eas) :
- 166 mJ
- Gate Charge (Qg) (Max) @ Vgs :
- 110nC @ 10V
- Power Dissipation-Max :
- 150W Tc
- Terminal Form :
- Gull wing
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -55°C~175°C TJ
- Vgs (Max) :
- ±20V
- Operating Mode :
- ENHANCEMENT MODE
- JESD-609 Code :
- e0
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Peak Reflow Temperature (Cel) :
- 225
- DS Breakdown Voltage-Min :
- 60V
- Rds On (Max) @ Id, Vgs :
- 12m Ω @ 43A, 10V
- Packaging :
- Tube
- Drain-source On Resistance-Max :
- 0.012Ohm
- Drain to Source Voltage (Vdss) :
- 60V
- Drain Current-Max (Abs) (ID) :
- 72A
- FET Type :
- N-Channel
- Pulsed Drain Current-Max (IDM) :
- 290A
- Package / Case :
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- RoHS Status :
- Non-RoHS Compliant
- Terminal Position :
- Single
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Published :
- 2001
- Transistor Element Material :
- SILICON
- Number of Elements :
- 1
- Current - Continuous Drain (Id) @ 25°C :
- 72A Tc
- Input Capacitance (Ciss) (Max) @ Vds :
- 1985pF @ 25V
- Datasheets
- IRFZ48VS

N-Channel Tube 12m Ω @ 43A, 10V ±20V 1985pF @ 25V 110nC @ 10V 60V TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
IRFZ48VS Description
International Rectifier's innovative HEXFET? Power MOSFETs use cutting-edge processing methods to produce extraordinarily low on-resistance per silicon area. This feature offers the designer a highly efficient and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET power MOSFETs are widely known for.
A surface mount power package called the D2Pak may accommodate die sizes as large as HEX-4. In comparison to other surface mount packages, it offers the largest power capacity and the least amount of on-resistance. Due to its low internal connection resistance and ability to dissipate up to 2.0W in a typical surface mount application, the D2Pak is appropriate for high current applications.
IRFZ48VS Features
-
Advanced Process Technology
-
Ultra Low On-Resistance
-
Dynamic dv/dt Rating
-
175°C Operating Temperature
-
Fast Switching
-
Fully Avalanche Rated
-
Optimized for SMPS Applications
IRFZ48VS Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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