IRFZ44NL
- Mfr.Part #
- IRFZ44NL
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-262-3 Long Leads, I2Pak, TO-262AA
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 49A TO262
- Stock
- 39,224
- In Stock :
- 39,224
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Power Dissipation-Max :
- 3.8W Ta 94W Tc
- Drain-source On Resistance-Max :
- 0.0175Ohm
- Input Capacitance (Ciss) (Max) @ Vds :
- 1470pF @ 25V
- Series :
- HEXFET®
- Transistor Element Material :
- SILICON
- Gate Charge (Qg) (Max) @ Vgs :
- 63nC @ 10V
- Pulsed Drain Current-Max (IDM) :
- 160A
- Terminal Position :
- Single
- Current - Continuous Drain (Id) @ 25°C :
- 49A Tc
- Avalanche Energy Rating (Eas) :
- 150 mJ
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- FET Type :
- N-Channel
- Operating Temperature :
- -55°C~175°C TJ
- Case Connection :
- DRAIN
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- DS Breakdown Voltage-Min :
- 55V
- Additional Feature :
- AVALANCHE RATED, HIGH RELIABILITY
- JESD-30 Code :
- R-PSIP-T3
- Packaging :
- Tube
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Vgs (Max) :
- ±20V
- Drain Current-Max (Abs) (ID) :
- 49A
- Mounting Type :
- Through Hole
- RoHS Status :
- Non-RoHS Compliant
- Transistor Application :
- SWITCHING
- Package / Case :
- TO-262-3 Long Leads, I2Pak, TO-262AA
- Rds On (Max) @ Id, Vgs :
- 17.5m Ω @ 25A, 10V
- Published :
- 2001
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Drain to Source Voltage (Vdss) :
- 55V
- Number of Elements :
- 1
- Number of Terminations :
- 3
- Operating Mode :
- ENHANCEMENT MODE
- Surface Mount :
- No
- Datasheets
- IRFZ44NL

N-Channel Tube 17.5m Ω @ 25A, 10V ±20V 1470pF @ 25V 63nC @ 10V 55V TO-262-3 Long Leads, I2Pak, TO-262AA
IRFZ44NL Description
International Rectifier's Advanced HEXFET? Power MOSFETs use advanced processing techniques to achieve extraordinarily low on-resistance per silicon area. This benefit, when paired with the high switching speed and ruggedized device architecture that HEXFET power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications. The is a surface mount power package that can handle die sizes up to HEX-4. It has the highest power capabilities and the lowest on-resistance of any surface mount package currently available. Because of its low internal connection resistance, the D2Pak is appropriate for high current applications and can dissipate in a conventional surface mount application. For low-profile applications, the through-hole variant (IRFZ44NL) is offered.
IRFZ44NL Features
-
Drain to Source Voltage (Vdss): 55V
-
Drain-source On Resistance-Max: 0.0175Ohm
-
DS Breakdown Voltage-Min: 55V
-
Gate Charge (Qg) (Max) @ Vgs: 63nC @ 10V
IRFZ44NL Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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