IRFZ34NS
- Mfr.Part #
- IRFZ34NS
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 29A D2PAK
- Stock
- 2,777
- In Stock :
- 2,777
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- FET Type :
- N-Channel
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- ECCN Code :
- EAR99
- Published :
- 1997
- Number of Terminations :
- 2
- Operating Mode :
- ENHANCEMENT MODE
- Transistor Application :
- SWITCHING
- Terminal Form :
- Gull wing
- JESD-30 Code :
- R-PSSO-G2
- Surface Mount :
- yes
- JESD-609 Code :
- e0
- Mounting Type :
- Surface Mount
- DS Breakdown Voltage-Min :
- 55V
- Additional Feature :
- AVALANCHE RATED, HIGH RELIABILITY
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Transistor Element Material :
- SILICON
- Operating Temperature :
- -55°C~175°C TJ
- Drain-source On Resistance-Max :
- 0.04Ohm
- Drain to Source Voltage (Vdss) :
- 55V
- Rds On (Max) @ Id, Vgs :
- 40m Ω @ 16A, 10V
- Avalanche Energy Rating (Eas) :
- 130 mJ
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Vgs (Max) :
- ±20V
- Current - Continuous Drain (Id) @ 25°C :
- 29A Tc
- Power Dissipation-Max :
- 3.8W Ta 68W Tc
- RoHS Status :
- Non-RoHS Compliant
- Peak Reflow Temperature (Cel) :
- 225
- Case Connection :
- DRAIN
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Terminal Position :
- Single
- Input Capacitance (Ciss) (Max) @ Vds :
- 700pF @ 25V
- Number of Elements :
- 1
- Qualification Status :
- Not Qualified
- HTS Code :
- 8541.29.00.95
- Series :
- HEXFET®
- Pulsed Drain Current-Max (IDM) :
- 100A
- Drain Current-Max (Abs) (ID) :
- 29A
- Package / Case :
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Packaging :
- Tube
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Gate Charge (Qg) (Max) @ Vgs :
- 34nC @ 10V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Datasheets
- IRFZ34NS

N-Channel Tube 40m Ω @ 16A, 10V ±20V 700pF @ 25V 34nC @ 10V 55V TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
IRFZ34NS Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications. The is a surface mount power package that can handle die sizes up to HEX-4. It has the highest power capabilities and the lowest on-resistance of any surface mount package currently available. Because of its low internal connection resistance, the D2 Pak is appropriate for high current applications and can dissipate in a conventional surface mount application. For low-profile applications, the through-hole variant (IRFZ34NL) is offered.
IRFZ34NS Features
-
Case Connection: DRAIN
-
Transistor Application: Switching
-
FET Type: N-Channel
-
RoHS Status: Non-RoHS Compliant
IRFZ34NS Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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