FS400R07A3E3H6BPSA1
- Mfr.Part #
- FS400R07A3E3H6BPSA1
- Manufacturer
- Infineon Technologies
- Package / Case
- Module
- Datasheet
- Download
- Description
- IGBT MODULE 650V 400A
- Stock
- 16,178
- In Stock :
- 16,178
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - IGBTs - Modules
- Operating Temperature :
- 175°C TJ
- NTC Thermistor :
- yes
- Configuration :
- Three Phase Inverter
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Current - Collector (Ic) (Max) :
- 400A
- Factory Lead Time :
- 26 Weeks
- Package / Case :
- Module
- RoHS Status :
- ROHS3 Compliant
- Voltage - Collector Emitter Breakdown (Max) :
- 650V
- Mounting Type :
- Chassis Mount
- Input :
- Standard
- Datasheets
- FS400R07A3E3H6BPSA1

FS400R07A3E3H6BPSA1 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available at
FS400R07A3E3H6BPSA1 Description
Infineon ’ s HybridPACKTM DC6 with ribbon bonded cooling structures is a variant of the HybridPACKTM 1 power module family with increased continuous current capability and a reduced stray inductance. Like all HybridPACKTM 1 products the HybridPACKTM DC6 with ribbon bonds is an automotive qualified power module designed for electric vehicle applications. Designed for a 150 ° C junction operation temperature, with a 30 hour limited 175 ° C capacity the module accommodates a 3-phase Six-Pack configuration of Trench-Field-Stop IGBT3 and matching emitter controlled diodes. The HybridPACKTM DC6 power module family is built on Infineon ’ s long time experience in the development of IGBT power modules, intense research efforts of new material combinations and assembly technologies. HybridPACKTM DC6 with ribbon bonds is suitable for direct liquid cooling. The copper base plate combined with high-performance ceramic substrate and Infineon ’ s enhanced wire-bonding process provides unparalleled thermal and power cycling capabilityand highest reliability for mild hybrid inverter or generator applications. For a compact design the driver stage PCB can easily be soldered on top of the module. All power connections are realized with screw terminals.
FS400R07A3E3H6BPSA1 Applications
· Automotive Applications
· Hybrid Electrical Vehicles(H)EV
· Commercial Agriculture Vehicles
· Motor Drives
FS400R07A3E3H6BPSA1 Features
· Low Switching Losses
· Low VcEsat
· Tvjop=150 °℃
· VCEsat with positive Temperature Coefficient
· Increased blocking voltage capability to 705V
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