CYD18S72V18-167BGXC

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Mfr.Part #
CYD18S72V18-167BGXC
Manufacturer
Infineon Technologies
Package / Case
484-FBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 484FBGA
Stock
13,059
In Stock :
13,059

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Package / Case :
484-FBGA
Clock Frequency :
167MHz
Memory Size :
18Mb 256K x 72
Operating Temperature :
0°C~70°C TA
Memory Interface :
Parallel
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Access Time :
4ns
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Memory Format :
SRAM
Packaging :
Tray
Supplier Device Package :
484-FBGA (23x23)
Memory Type :
Volatile
Introducing Memory Infineon Technologies CYD18S72V18-167BGXC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:484-FBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, CYD18S72V18-167BGXC pinout, CYD18S72V18-167BGXC datasheet PDF, CYD18S72V18-167BGXC amp .Beyond Memory Infineon Technologies CYD18S72V18-167BGXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD18S72V18-167BGXC


Memory Infineon Technologies CYD18S72V18-167BGXC Overview

The Memory Infineon Technologies CYD18S72V18-167BGXC is a high-capacity 18Mbit SRAM device, offering robust performance with its parallel interface, encapsulated in a compact 484FBGA package. This SRAM module is designed by Infineon Technologies, a leader in semiconductor innovation, ensuring advanced reliability and speed for demanding applications. Ideal for B2B customers looking to enhance their high-performance computing solutions, this memory component guarantees not only superior data retention capabilities but also efficient data handling, making it a pivotal component in advanced electronic systems.

CYD18S72V18-167BGXC Features

This IC SRAM features 18Mbit of memory, enabling high-speed data access and storage. The parallel interface ensures compatibility with a wide range of industrial and commercial applications, providing flexibility in system design. Its 484-ball fine pitch BGA package is designed for optimized thermal performance and reduced space footprint in complex circuits. Moreover, the device's robust design is tailored for extended operational life, making it suitable for intensive applications that require reliable and continuous memory access.

CYD18S72V18-167BGXC Applications

  • Advanced Telecommunication Systems: Utilized in routers and switches for buffering and processing large volumes of data quickly and efficiently.
  • Automotive Electronics: Integrated into automotive systems for real-time data processing in navigation, safety, and engine control units.
  • Industrial Automation: Employed in PLCs and industrial PCs to manage operational data and facilitate complex automation processes.
  • Medical Equipment: Applied in medical diagnostic systems where quick data access is crucial for real-time patient monitoring and analysis.
  • Consumer Electronics: Used in high-performance gaming consoles and computers, enhancing the overall user experience with faster memory operations.
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