CYD18S72V18-167BBXC

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Mfr.Part #
CYD18S72V18-167BBXC
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 256FBGA
Stock
31,258
In Stock :
31,258

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
JESD-30 Code :
S-PBGA-B484
Surface Mount :
yes
Terminal Position :
BOTTOM
Pin Count :
484
Lead Free :
Lead Free
JESD-609 Code :
e1
Memory Size :
18Mb 256K x 72
Memory Format :
SRAM
Address Bus Width :
36b
Operating Temperature :
0°C~70°C TA
Number of Ports :
2
Packaging :
Tray
Operating Supply Voltage :
1.8V
Access Time :
4ns
RoHS Status :
ROHS3 Compliant
Number of Functions :
1
Terminal Pitch :
1mm
Base Part Number :
CYD18S72
Published :
2005
Memory Interface :
Parallel
Clock Frequency :
167MHz
Density :
18 Mb
Peak Reflow Temperature (Cel) :
260
Package / Case :
256-LBGA
Supply Voltage :
1.5V
Number of Terminations :
484
Supply Voltage-Max (Vsup) :
1.58V
Memory Width :
72
Memory Type :
Volatile
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of Pins :
256
Qualification Status :
Not Qualified
Introducing Memory Infineon Technologies CYD18S72V18-167BBXC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Base Part Number:CYD18S72, Package / Case:256-LBGA, Number of Terminations:484, Mounting Type:Surface Mount, Number of Pins:256, CYD18S72V18-167BBXC pinout, CYD18S72V18-167BBXC datasheet PDF, CYD18S72V18-167BBXC amp .Beyond Memory Infineon Technologies CYD18S72V18-167BBXC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD18S72V18-167BBXC


Memory Infineon Technologies CYD18S72V18-167BBXC Overview

The Memory Infineon Technologies CYD18S72V18-167BBXC is a high-capacity, 18Mbit SRAM module, designed for demanding applications that require rapid access to large volumes of data. Manufactured by Infineon Technologies, this integrated circuit is housed in a compact 256FBGA package, ensuring robust performance and reliability. Ideal for high-speed data buffering and intensive processing tasks, this SRAM offers a parallel interface for fast data transfer rates, making it a prime choice for industrial and advanced technological applications. Its dense configuration and efficient design make it particularly suitable for businesses looking to enhance system performance while maintaining energy efficiency.

CYD18S72V18-167BBXC Features

This SRAM module boasts several features that make it a standout option for integrating into various high-performance computing environments. Key features include a large 18Mbit capacity, a parallel interface for enhanced data transfer speeds, and a standard 256FBGA packaging that assures compatibility with a wide range of existing systems. Moreover, its low-latency design optimizes system responsiveness, which is crucial for applications requiring real-time processing.

CYD18S72V18-167BBXC Applications

  • Advanced Computing Systems: Utilized in servers and high-performance computers for fast data access and short-term data storage, improving processing speed and efficiency.
  • Networking Equipment: Deployed in routers and switches to manage routing tables and buffer data, enhancing network traffic management and reliability.
  • Telecommunications Infrastructure: Critical for telecom applications where large volumes of data need to be buffered, ensuring seamless data flow and system stability.
  • Industrial Automation: Applied in automation controllers and real-time processing units, where quick access to data is essential for controlling and monitoring automated processes efficiently.
  • Aerospace and Defense: Utilized in mission-critical aerospace systems, where robustness and high data integrity are required for navigation and control systems.
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