CYD18S72V18-167BBXI

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Mfr.Part #
CYD18S72V18-167BBXI
Manufacturer
Infineon Technologies
Package / Case
256-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 256FBGA
Stock
110
In Stock :
110

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Packaging :
Tray
Published :
2005
Number of Pins :
256
Pin Count :
484
Number of Functions :
1
Number of Ports :
2
Memory Type :
Volatile
Density :
18 Mb
Package / Case :
256-LBGA
Mounting Type :
Surface Mount
Terminal Pitch :
1mm
Number of Terminations :
484
Terminal Position :
BOTTOM
Base Part Number :
CYD18S72
Memory Size :
18Mb 256K x 72
Voltage - Supply :
1.42V~1.58V 1.7V~1.9V
Time@Peak Reflow Temperature-Max (s) :
40
Surface Mount :
yes
Memory Interface :
Parallel
Operating Temperature :
-40°C~85°C TA
Supply Voltage-Max (Vsup) :
1.58V
Supply Voltage :
1.5V
JESD-30 Code :
S-PBGA-B484
JESD-609 Code :
e1
Address Bus Width :
36b
Operating Supply Voltage :
1.8V
Access Time :
4ns
Moisture Sensitivity Level (MSL) :
5 (48 Hours)
Clock Frequency :
167MHz
Radiation Hardening :
No
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Peak Reflow Temperature (Cel) :
260
Memory Format :
SRAM
Lead Free :
Lead Free
RoHS Status :
ROHS3 Compliant
Memory Width :
72
Introducing Memory Infineon Technologies CYD18S72V18-167BBXI from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:256, Package / Case:256-LBGA, Mounting Type:Surface Mount, Number of Terminations:484, Base Part Number:CYD18S72, Operating Temperature:-40°C~85°C TA, CYD18S72V18-167BBXI pinout, CYD18S72V18-167BBXI datasheet PDF, CYD18S72V18-167BBXI amp .Beyond Memory Infineon Technologies CYD18S72V18-167BBXI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CYD18S72V18-167BBXI


Memory Infineon Technologies CYD18S72V18-167BBXI Overview

The Memory Infineon Technologies CYD18S72V18-167BBXI is a state-of-the-art SRAM device featuring a substantial 18Mbit storage capacity, ideal for applications requiring high-speed, high-density memory storage. Manufactured by Infineon Technologies, this IC offers robust performance encapsulated in a 256FBGA package, ensuring compact integration and reliable durability. Its parallel interface facilitates quick data access and throughput, making it a versatile choice for a wide range of industrial and commercial applications. With its advanced technical specifications and dependable performance, the Memory Infineon Technologies CYD18S72V18-167BBXI stands as a superior choice for businesses looking to enhance their electronic systems with efficient and high-capacity memory solutions.

CYD18S72V18-167BBXI Features

  • 18Mbit High-Density Storage: Ample storage capacity for complex applications requiring large amounts of data.
  • Parallel Interface: Facilitates rapid data access and processing, suitable for high-performance computing tasks.
  • 256FBGA Package: Compact footprint for space-sensitive applications, providing efficient use of PCB area.
  • High Reliability: Engineered by Infineon Technologies, known for their rigorous quality standards and robust product designs.

CYD18S72V18-167BBXI Applications

  • Networking Equipment: Enhances performance in routers and switches through fast data buffering and retrieval.
  • Telecommunications: Utilized in telecom infrastructure to manage large-scale data transactions efficiently.
  • Industrial Automation: Supports complex control systems by providing quick access to data, crucial for real-time processing and decision-making.
  • Medical Devices: Essential in advanced medical imaging systems where large amounts of data require rapid processing and storage.
  • Aerospace: Deployed in avionics for its ability to handle high-density data management under stringent conditions.
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Shipping Cost

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